Western Digital Staff Engineer Package Design/Development Q & R Engineering 

Philippines, Baguio 

891740944

But we can’t do it alone. Today’s exceptional data challenges require your exceptional skills. It’s You & Us. Together, we’re the next big thing in data.

• Collaborate with cross-teams to perform early risk assessment and design optimization for SIP packaging products, ensuring the most feasible design with best DFX for final product use.
• Define package design NUDDs and work with process/product develop team to initiate necessary new technology programs development for future product applications.
• Lead deep-dive discussions on design, process and product-related procedures to address critical product requirements and drive solutions to accelerate new product TTM.
• Partner with the team to mitigate design risks through simulation and feasibility studies.
• Work with IT teams on system development, including defining the Statement of Work (SOW), development, conducting User Acceptance Testing (UAT), and providing training.

• MS or PhD in Mechanical or Materials Engineering.
• Strong knowledge of semiconductor package design is highly desired.
• Excellent coordination skills with the ability to work effectively with cross-function team.
• Proficient in English with strong presentation and communication skills.
• Demonstrated ability to multitask, meet tight deadlines, and working under pressure.

Desired Skills:

• Candidates with semiconductor packaging process and design background/experience will be mostly preferred.