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Apple Process Development Engineer R&D Singapore 891337121
11.07.2024
Description
- Work on process equipments to conduct proof of concept evaluation and DOEs - Establishment of baseline process and metrics- Perform process characterisation- Establish design guidelines for manufacturabilty- Define procedures and metrologies- Generate engineering report base on studies and evaluation
Minimum Qualifications
- Degree of Science in Engineering or equivalent
Preferred Qualifications
- Minimum 5 years of experience in doing process R&D
- Hands-on experience in various module assembly processes such as flip chip, flex attach, pick and place, dispensing, bonding, filling, laser soldering, component cleaning, curing, plating, singulation, wafer bonding.
- Good knowledge in design of experiment (DOE), engineering statistic, root cause analysis and problem solving
- Familiarity on different metrology tools and quantitative measurement methodology
- Clear and effective written and communication skill
- Resourceful and innovative
- Knowledge and work experience in one or more of the following processes & handling such processes equipment - 1) Flip Chip bonding (Thermosonic, Thermocompression and etc) OR 2) EVO die bonder, EVG and Suss process equipment OR 3) Flex Attach (Flexible Printed Circuit Board Bonding), Solder Jetting/Laser Wire Soldering OR 4) SMT (e.g. solder printing, component pick&place, AOI, SPI and reflow)
- Knowledge on adhesive or epoxy or other bonding material is an advantage
- Experience in optical components, active alignment and high accuracy bonding process is preferred
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