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Mobileye Experienced Chip Package Design Engineer Israel, Center District, Petah Tikva 827832245
Yesterday
What will your job look like:
- Technical Project lead & Co Design to support the development of IC package with the OSAT, Si, VLSI and System Architecture teams.
- Manage subcontractors and vendors for development and manufacturing of chip substrate, IC package and IC testing
- Design and hands-on one of the chip package layout, simulate high-performance signal/power-integrity chip substrate, including layout, mechanical & thermal simulations
- Collaborate and support peer teams from other projects
All you need is:
- B.Sc in Electronic or Mechanical Engineering
- 3+ years of hands-on experience as managing chip packaging vendors
- 5+ years of hands-on experiences in chip package activities
- Experience with relevant CAD tooling for chip package development & simulation for layout, mechanical & thermal simulations
- Experience with Digital High Speed, Analog and Power design
- Experience with Signal Integrity and Power Integrity simulation tools for Digital and analog using IBIS and S-Parameters models – advantage
- Familiar with Automotive industry– advantage
- Experience with RFIC design and simulation - advantage
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