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Job Description
Duties &Responsibilities:
Education/Knowledge:Bachelor’s degree or above in related field e.g. Engineering, electrical, material science, physics or equivalent to it.
3 to 7 years of working experience with Crystal, Wafer Level Packaging (WLP) & Semiconductor components and the following design and process technologies: switching / linear regulators, Digital/Analog IC design, CMOS / BiCMOS and semiconductor packaging. Hands-on experience in process, test, and quality. Experience in PMIC, ASIC, DDR and discrete devices is an added advantage.
Requirement Skills:
משרות נוספות שיכולות לעניין אותך