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What You Will Be Doing:
Responsible for architecting, developing, characterization of next generation power and thermal management features and solutions working with multi-functional teams across the company.
Drive methodologies for deployment of features into products.
Drive initiatives for power and thermal optimizations spanning across silicon, platform, software, manufacturing, and product systems; for products ranging from largescale datacenters to low-power client devices.
Debug and architect solutions for issues seen by customers in the field across a wide range of industries.
Influence next generation SW, chip, board, and platform design of products across SOC, GPU and CPUs in Laptops, Servers, and Datacenters
Work alongside system architects, designers, chip and board designers, software/firmware engineers, HW/SW applications engineering, process/reliability authorities, ATE engineers, and silicon operations, in a fast-paced, high-energy, collaborative work environment to bring industry-defining products to market.
What We Need to See:
B. Tech or M. Tech in Electronics Engineering, Computer Science, or related field (or equivalent experience)
5+ years of experience in silicon bring-up, validation, and productization.
Experience with power and thermal controllers and management.
Expertise and deep understanding in the areas of silicon power, transistor/device physics, power modeling and measurement, active power management is a plus
Proficiency in Python, Perl or C programming languages.
Self-starter with strong skills in multi-tasking, influencing, communication, presentation, and consensus-building
Enthusiastic, responsive, and keen on process improvement
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