

Intern position in the field of ESD (ElectroStatic Discharge) characterization.
As needed, simulations will be carried out to support the measurement data and to get a full understanding of the physical behavior of the structures.
The TLP system will also be used to exercise the capability of packaged ICs to handle system level ESD stress (SEED characterization), providing a guidance for system integration.
Qualifications:Minimum Qualifications:
Preferred Qualifications:
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