המקום בו המומחים והחברות הטובות ביותר נפגשים
Delivers signal integrity, power integrity and radio frequency and electromagnetic compatibility solutions for large, complex high-speed platforms, boards, packages, and silicon. Develops and analyzes 2D and 3D model extraction across die/C4 bumps, silicon, package, sockets, and boards. Defines specification/rules, reviews implementation, documents characterization and measurement reports, and improves and optimizes design margins. Develops test structures, electrical analysis methodology and verification plans to address challenges. Performs measurements to characterize/correlate to verify electrical specification after design and correlate back to pre-silicon analysis/estimations. Documents and provides implementation guidelines to the end customers as part of the platform design guide. Collaborates with IP design teams and silicon integration teams to ensure the IP and SoC designs maximize the platform level solution space to meet targeted product landing zone requirements and minimize quality degradation (e.g., attenuation, crosstalk, jitter, power noise) and cost.
Your responsibilities will include but are not limited to:
Candidate must possess the below minimum qualifications to be initially considered. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork/classes/research and/or relevant previous job and/or internship experience.
Preferred Qualification:
משרות נוספות שיכולות לעניין אותך