Microsoft Principal Analog Design Engineer 

Malaysia, Penang 

77005747

:

Required Qualifications:

• Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience or internship experience
• Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 10+ years technical engineering experience or internship experience
• Doctorate degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience or internship experience.
• 7+ years of experience in a role that involves mixed-signal design.
• 5+ years of experience working with large cross-functional teams with diverse opinions.
• 2+ years of experience in High speed mixed-signal design.

Preferred Qualifications:

• Demonstrated experience in design through volume production of modern SOCs
• Experience with Foundry Silicon and packaging technologies.
• Proficient with the latest mixed-signal design flows and tools.
• Experience with Power Delivery or Power Management Circuits
• Experience with Design Flow automation and scripting.
• Analyze and drive characterization and test data from lab and high-volume testing.

Making a difference

We fundamentally believe that we need a culture founded in a Growth Mindset. It starts with a belief that everyone can grow and develop; that potential is nurtured, not pre-determined; and that anyone can change their mindset.

Responsibilities:

• Design, model, and simulate Power Delivery Solutions (i.e., incl. IP design, voltage regulator, motherboard, CPU package, silicon, and decoupling capacitor solution) for data center processors and corresponding platforms to ensure optimized performance.
• Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers
• Interface and collaborate with other physical design, Design for Test (DFT), Design verification and System on Chip (SoC) integration.
• Supervise and optimize layout in latest silicon and packaging technologies.
• Develop characterization and test plans and support bring-up, debug activities.
• Drive new technologies to innovate analog and mixed signal circuits for advanced silicon nodes to improve performance/power metrics.
• Coach and mentor junior electrical engineers to grow overall team competency.
• Collaborate with cross functional team members with respect and with One Microsoft mentality to establish synergies