Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.
Job Description
Perform failure analysis in finished or semi-finished failed product in drive, package or device level.
Define FA flow for each FA case.
Generate FA report and assist process engineer for root causing of defect/s.
Maintain the FA dashboard and FA equipment in good condition.
Develop the FA process and FA capability for new product and new technologies node.
Innovate new FA methodology to improve TAT and FA accuracy.
Qualifications
Bachelor Degree and/or Master in Electrical/ Electronic, Microelectronic Engineering or Material Engineering with minimum 5 years in failure analysis.
Familiar with SSD system, IC package and device analysis methodology.
Familiar with semiconductor and SMT assembly process and technology.
Familiar with memory product technology and structure.
Understand memory product test process and methodology.
Skillful in performing failure analysis with FA tools or methodology such as 3D X-ray, CSAM, SEM/EDX, chemical decapsulation, TDR, curve tracer analysis, optical microscopes, hot spot analysis.
Strong memory IC de-processing skills.
Good communication and presentation skills.
Good teamwork spirit and growth mindset.
Fluent in English speaking, reading and technical FA report writing.
Previous electrical FA experience in IC or memory devices is preferred.