IBM Semiconductor Engineering Position Yorktown Heights NY 

United States, New York 

75494471

Familiarity with semiconductor processing and specifically bonding processes. Capability of learning new processes and semiconductor packaging tools quickly is also key. Driving improvements with processes and tools through inspection and metrology, with a goal of tighter quality distribution, higher efficiency (throughput improvements) and great yield.
Preferred Technical and Professional Expertise

Familiarity with wafer-to-wafer, metal-to-metal bonding, and thermal compression bonding (TCB), as well as debonding techniques. Great manual dexterity for manipulating smaller mechanical parts. Good organizational, communication and presentation skills.