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Intel FEOL Front-End-Of-Line Process Integration Development Engineer 
Ireland 
718952804

08.04.2025
Job Description:

FEOL (Front-End-Of-Line) Integration Development Engineers are
responsiblefor:

  • Leading engineering projects to execute high-volume manufacturing (HVM) yield roadmaps and achieve performance targets.

  • Collaborating with Technology Development and Local Yield teams to implement new technologies in production fabs.

  • Working with FEOL/BEOL Integration, Device, Defect Reduction, and Yield Analysis teams to identify root causes of yield and performance issues and executing mitigation plans within set timelines.

  • Conducting feasibility studies and experiments to characterize processes and enhance product performance throughout development.

  • Managing New Product Introductions (NPI) in production fabs and optimizing processes to meet foundry customer specifications.

  • Partnering with Local Yield teams to improve product yield, quality, performance, and reduce wafer costs.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

MinimumQualifications:

  • Bachelor's degree in a relevant science or engineering field, with at least 4 years of experience.

  • Experience in advanced node semiconductor industry, specifically in FEOL Process Integration; level of experience will influence job grade.

  • Proficient understanding of Device Physics, with experience in FinFET or Gate-All-Around technology development or high-volume manufacturing.

  • Familiarity with module processes such as lithography, dry etch, wet etch, CMP, diffusion, implant, thin films, and metrology.

  • Strong problem-solving skills, self-initiative, and ability to learn independently.

  • Ability to collaborate effectively with multi-functional and multi-cultural teams.

  • Excellent communication skills.

PreferredQualifications:

  • Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics, or Materials Science; related fields may be considered based on industry experience.

  • Experience in project/program management and/or as a TFT lead.

  • Strong interpersonal skills, including the ability to influence and motivate others.

  • Experience engaging with external foundry customers through technical interactions.

  • Familiarity with GAA (Gate-All-Around) technology architecture.

  • Background in new semiconductor technology development. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and orschoolwork/classes/research.


Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and orschoolwork/classes/research.

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