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IBM Semiconductor Engineering Position Yorktown Heights NY 
United States, New York 
716869801

08.05.2024


Familiarity with MUV lithography, wet processing techniques for patterning layers, and silicon chip cleaning processes is important. Capability of learning new processes and semiconductor packaging tools quickly is also key. Driving improvements with processes and tools through inspection and metrology, with a goal of tighter quality distribution, higher efficiency (throughput improvements) and great yield.
Familiarity with specific silicon processing, such MUV dry film lithography. Great manual dexterity for manipulating smaller mechanical parts. Good organizational, communication and presentation skills.