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Apple IC Package Design Engineer United States, California 706358700
06.06.2024
Description
- Implement the physical design of packages and modules for SoC, Memory, RF and cellular chips. - Interface and coordinate with multi-functional groups throughout Apple on new product package/SiP/module feasibility analysis, design and selection. - Define and develop design verification and automation strategy to strengthen and streamline package design as well as release flows.- Work multi-functionally to optimize package pin out. - Perform extraction of S-parameters and package RLGC model. - Ensure package design is optimized with SI/PI requirements.- Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.- Explore, evaluate and develop new CAD tool, design and verification flow. - Partner with Silicon PD team to optimize chip Floorplan and bump placement, and minimize package size.
Key Qualifications
- As the IC Package Design Engineer, you demonstrate fundamental knowledge or proven experience in the following:
- BS and 3+ years of relevant industry experience.
- Proven fundamentals in the electrical/material/thermal/ or mechanical engineering field(s).
- Familiarity with various sophisticated package configurations and assembly/ substrate technology (wirebond, POP, etc.).
- Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
- Basic understanding in some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters and RLGC model.
- Basic knowledge of substrate manufacturing process, structure, design rules and material property.
- Proven understanding of high-speed interfaces, including DDR, PCIe, NAND, etc.
- Exposure to Unix environment, scripting languages (PERL, Python, TCL and or shell) and methodology.
- Preferred Skills:
- Familiarity with CAM350/Valor or Calibre and CAD and experience with package design reviews.
- Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance).
- Design experience with RFIC and 5G packages, SIP or module schematic and layout design experience.
- Solid understanding of Design Rules Check and Design for Manufacturing.
Education & Experience
- BS and 3+ years of relevant industry experience.
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $138,900 and $256,500, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.
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