Nvidia Senior Engineer OSAT Assembly Manufacturing Operations 

Taiwan, Taiwan Province, Hsinchu 

695232952

We need someone who has a solid technical background as well as an excellent reputation with our manufacturing partners. You will be reporting to Director of IC Supply Chain and Manufacturing.
What You Will Be Doing

• Bring new products and new technologies to high volume manufacturing

• Drive continuous improvement in manufacturing yield, cycle time and product quality/reliability

• Address manufacturing execution and quality issues through systemic solutions

• Deliver datamation solutions for enhanced decision making

• Manage supplier performance evaluation matrix and keep it updated based on changing business needs

• Lead change control through qualification and notification

• Lead non-conforming material disposition and problem solving

What We Need To See

• Master’s degree or higher in Engineering or Science with emphasis on Mechanical, Materials Science, Chemical Engineering fields (or equivalent experience)

• 12+ year validated experience in Flip Chip semiconductor packaging design, process and materials development. Direct experience in advanced assembly technologies such as 2.5D/3D packaging is essential. Photonics packaging experience is a plus

• Thorough understanding of chip assembly equipment design --- knowledge of materials, process, substrate/package design in chip assembly operations. Experience with PCB assembly is a plus

• Extensive project management and OSAT management experience

• Strong statistical analysis skills – ability to use data visualization techniques to deliver decisions

• Deep understanding of quality control, statistics process control, gage R&R and DOE techniques

• Knowledge of packaging industry and its supply chain

• Excellent written and oral communication skills