What you will be doing:
Collaborate with cross-functional teams, including hardware, software and product management to develop & lead BSP activities.
Develop, maintain CI/CD systems.
Design and maintain branches, releases and test infrastructure.
Debug & resolve issues w.r.t SOC FW, drivers.
Lead all aspects of SoC packaging processes, ensuring compatibility and performance across different platform components.
Be hands-on with integrating different components to create a BSP package.
Lead automation of tools, test cases to bring efficiency to BSP activities.
Stay at the forefront of the latest advancements in CI/CD, BSP, SoC & platform technologies and drive their adoption within the team.
What we need to see:
Bachelor’s or Master’s degree in Computer Science, Electrical Engineering, or a related field.
5+ years of proven experience in developing, maintaining CI/CD systems, leading release activities.
Extensive experience with debugging tools, SCM(GIT, Perforce) infrastructure, etc.
Extensive experience with automation of large scale test plans.
Ability to triage issues with boot FW, UEFI, EC, SOC Drivers.
Proficiency in programming languages such as Python, C/C++.
Strong problem-solving skills and attention to detail.
Excellent communication, leadership, and teamwork abilities.
Ways to stand out from the crowd:
Proficient with understanding of ARM architecture.
Experience with SoC firmware packaging, boot sequence, etc.
Developed CI/CD, Releases and test automation framework right from scratch.
Provided creative solution to improve efficiency of system testing and development.
משרות נוספות שיכולות לעניין אותך