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Apple Materials Engineer Singapore 636867521
Yesterday
Excellent opportunity to be involved in material development, you will be responsible for select selection, characterization and optimization of adhesive and interconnect materials for electrical and optical modules and packaging.
You will drive material selection for semiconductor packaging and module assembly, in particular adhesives for mechanical and electrical interconnect purposes. Perform new material characterization and understand material applications and feedback findings or issues encountered during characterization.
- Degree of Materials/Chemical Engineering
- More than 3 years’ experience in DMA/TMA/DSC/Rheometer/TGA characterisation
- Experience/knowledge on adhesive material formulation
- Experience on GCMS
- Material level characterization methodology development (how to correlate with module performance)
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