Cisco Package Design Engineer 

United Kingdom, England 

626939468

• Lead package design tasks, planning and driving schedules from concept through implementation
• Optimize package pinouts, stack-ups, power distribution, and high-speed routing, balancing performance and manufacturability
• Collaborate with silicon floor planning, signal integrity (SI), and power integrity (PI) teams to ensure design quality and efficiency
• Work closely with layout editors to deliver high-quality package designs aligned with interface requirements
• Enhance design methodologies and partner with vendors to improve product quality and efficiency
• Drive innovation in package solutions for Cisco’s next-generation ASICs

• Bachelor’s degree in Electrical Engineering or a related field
• Experience in ASIC package design, including optimizing pinouts, stack-ups, and high-speed routing
• Familiarity with relevant industry-standard EDA tools for layout and design for chip package development & simulations
• Practical experience in chip packaging processes, including vendor collaboration and management to ensure successful package development
• Strong understanding of high-speed signal design and power distribution networks (PDN)
• Strong analytical and problem-solving skills in debugging and optimizing package designs

Preferred Qualifications

• Master’s degree in Electrical Engineering
• Knowledge of silicon floor planning, signal integrity (SI), and power integrity (PI) considerations
• Proven track record to drive design improvements and lead stakeholder coordination throughout the design process
• Familiarity with advanced testing and measurement equipment, including oscilloscopes and TDR/VNA analyzers