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Apple Panel Backend Process Engineer United Kingdom, England, London 610554951
30.05.2024
Description
- The panel backend process engineer will be responsible for the IC and FPC bonding process and equipment maintenance. - Familiar with design of experiments (DOE), problem solving and failure analysis skill to improve yield.
Minimum Qualifications
- Master’s degree in science and engineering related field or 3 years of equivalent work experience. Have hands-on experience in operating and maintaining bonding machine.
- Familiar with OLED panel process and good skill at design of experiments (DOE), failure analysis (FA), and can adjust process recipe through getting insight into the DOE and FA results rather than trial and error.
Preferred Qualifications
- Have hands-on experience in operating SEM, FIB and able to do FA independently.
- Familiar with the reliability testing for material mechanical strength and defect detection method
- Preferred qualifications are the nice-to-have (i.e., very important but not required) knowledge, skills, abilities, and other competencies that contribute to successful job performance in the role.
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