Western Digital Principal Engineer Packaging Engineering 

Canada, British Columbia, Area H (Cultus Lake/Columbia Valley) 

609916660

But we can’t do it alone. Today’s exceptional data challenges require your exceptional skills. It’s You & Us. Together, we’re the next big thing in data.

•Defines, develops and qualifies new wafer level packages with subcontractors and maintains quality of existing packages. ·

•Manages next generation packaging technologies with internal R&D teams and eternal technology partners

•Works closely with the various business units within the company to understand future product needs and suggest packaging solutions.

•Drive yield improvement and better efficiency of subcontractors operation

•Manages the entire life cycle of packages from path finding all the way to qualification and HVM

•This position requires a candidate with Bachelor/ Master degree in Mechanical / Materials Engineering or equivalent with several years of relevant work and packaging program management experience

•Hands-on experience in various aspects of packaging such as design, material, process etc required.

•Experience working closely with wafer fabrication facilities, testing houses and substrate suppliers highly desirable

•Knowledge of electrical aspects of packaging, EFA/ PFA flow, signal and power integrity (SI / PI) analysis background is plus.

•Knowledge of wafer level package as bumping, RDL, 3D packaging

•Working knowledge of AutoCAD, Cadence APD, Finite Element Analysis, Design of Experiments, statistical techniques and package failure analysis techniques required.

•Ability to multi-task and meet tight deadlines as well as excellent communication and interpersonal skills required