Expoint - all jobs in one place

המקום בו המומחים והחברות הטובות ביותר נפגשים

Limitless High-tech career opportunities - Expoint

Western Digital Senior Manager Hardware Development Engineering 
Spain, Catalonia, Barcelona 
60801526

30.12.2024
Company Description

Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.

Job Description

Chemical Mechanical Planarization (CMP) Process Development is part of the Wafer Wet Process Development, the engineering manager will be responsible to lead the CMP process development team to develop new CMP process and technology, enable and accelerate technology deployment into head products to meet HDD requirements through product life cycle.

  • Lead a group of talented process development engineers and technicians responsible for CMP new process development.
  • Guide and prioritize CMP development team on long term and short term projects, to meet new product launch requirement and schedule.
  • Supervise team to develop or evaluate new CMP processing technology, methodology, consumables or advance tooling to meet new product needs and manufacturability.
  • Work with cross functional teams including design, integration, and other development process modules on designs incorporating CMP or resolving any integration issue.
  • Guide team on trouble-shoot the related issues in development line, conduct defect analyses, root cause analyses, and implement corrective and preventive actions.
  • Be responsible for team on new process to manufacturing engineering (ME) transferring, support ME team on necessary process implementing and manufacturing ramping.
Qualifications

REQUIRED

  • PhD degree in physics, chemistry, chemical engineering, materials science, or a related engineering field.
  • At least 5 year of knowledge / working experience on CMP process development, and post cleaning processes.
  • Understanding other process techniques, such as photolithography, dry or wet etching, electroplating, or thin film deposition processes,
  • Experience in wafer-level magnetic recording head fabrication and integration are desirable.
  • Excellent communication skills, both written and oral. Able to work on the resolution of any issue and to interact with various interdepartmental team and support organizations.
  • Demonstrated leadership and project driving skills, capable of managing team and projects with set milestones and timeline, and ability to execute.
  • Experience with statistical analysis tools, such as JMP, is a plus.

Compensation & Benefits Details

  • An employee’s pay position within the salary range may be based on several factors including but not limited to (1) relevant education; qualifications; certifications; and experience; (2) skills, ability, knowledge of the job; (3) performance, contribution and results; (4) geographic location; (5) shift; (6) internal and external equity; and (7) business and organizational needs.
  • The salary range is what we believe to be the range of possible compensation for this role at the time of this posting. We may ultimately pay more or less than the posted range and this range is only applicable for jobs to be performed in California, Colorado, New York or remote jobs that can be performed in California, Colorado and New York. This range may be modified in the future.
  • You will be eligible to participate in Western Digital’s Short-Term Incentive (STI) Plan, which provides incentive awards based on Company and individual performance. Depending on your role and your performance, you may be eligible to participate in our annual Long-Term Incentive (LTI) program, which consists of restricted stock units (RSUs) or cash equivalents, pursuant to the terms of the LTI plan. Please note that not all roles are eligible to participate in the LTI program, and not all roles are eligible for equity under the LTI plan. RSU awards are also available to eligible new hires, subject to Western Digital’s Standard Terms and Conditions for Restricted Stock Unit Awards.
  • We offer a comprehensive package of benefits including paid vacation time; paid sick leave; medical/dental/vision insurance; life, accident and disability insurance; tax-advantaged flexible spending and health savings accounts; employee assistance program; other voluntary benefit programs such as supplemental life and AD&D, legal plan, pet insurance, critical illness, accident and hospital indemnity; tuition reimbursement; transit; the Applause Program, employee stock purchase plan, and the Western Digital Savings 401(k) Plan.
  • Note: No amount of pay is considered to be wages or compensation until such amount is earned, vested, and determinable. The amount and availability of any bonus, commission, benefits, or any other form of compensation and benefits that are allocable to a particular employee remains in the Company's sole discretion unless and until paid and may be modified at the Company’s sole discretion, consistent with the law.