Western Digital Senior Manager Packaging Engineering 

Spain, Catalonia, Barcelona 

567868952

Here’s how you can help.

Senior Manager in this role will be responsible for researching, developing, and implementing innovative packaging solutions and requires a deep understanding of solid-state device physics, materials science, and packaging technologies, and expected to manage all aspects of packaging technologies required for Materials Center of Excellence (MCoE). Responsibilities encompass a wide range of tasks, from strategic planning to day-to-day operations, and require a combination of technical expertise, leadership skills, and problem-solving abilities. Candidate shall be specialized in advanced 3D & heterogenous packaging solutions, plays a critical role in ensuring successful and efficient implementation of next gen flash products.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Strategic Planning: Develops and implements long-term strategies on introducing advanced materials for solid-state device packaging to align with overall business objectives and market trends.
• Team Leadership: Manages and motivates a team of packaging engineers, technicians, and support staff.
• Material & Process Optimization: Identifies and implements advanced materials to be used in packaging processes to enhance efficiency, reduce costs, and improve performance and reliability of solid-state devices.
• Technology Evaluation: Assesses new packaging technologies and materials specifically designed for solid-state devices, such as advanced thermal management solutions and new gen 3D packaging techniques.
• Supplier Management: Oversees relationships with suppliers of packaging materials, equipment, and testing services tailored for SiP & Solid-state devices.
• Budget Management: Develops and manages budgets for Materials CoE Lab & path finding projects for next gen drives.
• Quality Control: Ensures that packaging operations adhere to strict quality standards and regulations specific to materials used in flash devices.
• Regulatory Compliance: Ensures compliance with relevant industry regulations and standards related to solid-state device packaging.
• New Product Introduction (NPI): Coordinates the introduction of new materials in packaging technologies and processes for SSD.

Candidate shall possess at least 15+ years of experience with a Master’smaterials science, electrical or mechanical engineering and preferably specialized in solid-state physics, semiconductor devices, and packaging technologies.

SKILLS:

• Leadership Skills: Ability to lead and motivate teams, build consensus, and make effective decisions.
• Problem-Solving Skills: Ability to identify and solve complex problems related to packaging solid-state devices.
• Project Management Skills: The ability to manage multiple projects simultaneously and deliver results on time and within budget.

• Communication Skills: The ability to communicate effectively with both technical and non-technical stakeholders.
• Office: Spending time in an office environment, planning, analyzing data, and communicating with colleagues.
• Manufacturing Floor: Visiting the manufacturing floor to inspect equipment, monitor processes, and troubleshoot problems related to solid-state device packaging.
• Supplier Facilities: Traveling to supplier facilities to evaluate new material technologies, processes and equipment specifically designed for packaging.