Intel Senior Dry Etch Process Engineer 

China, Liaoning, Dalian 

555221788

Technical Qualifications:MS or PhD in a science or engineering field and minimum 5 years of experience in semiconductor or 3 years in TD environment are required Candidates with different levels of technical experiences will be considered at different grade levels.Broad and in-depth knowledge of plasma dry etch chambers processes is required.Mastery of principles and working knowledge of various Dry etch processes and LAM etch equipment.Ability to design execute and analyze experiments to screen and optimize various Dry Etch processes and equipment to meet technology performance yield and reliability and manufacturing process stability cost of ownership capacity improvement targets.Strong problem-solving skills. Be master on MBPS and FMEA methodology.Strong project management skills, good influence and communication skills.Hands on experiences in technology development and technology transfer are highly desired.Must be willing to learn and work in a dynamic fast paced environment. Other Qualifications:Motivated self-starter with strong ability to work independently as well as in a team environment.Strong verbal and written communication skills in English.Think and operate independently while simultaneously focusing on many diverse priorities.Flexibility and maturity in facing uncertainties and changing priorities responsibilities.Commit to aggressive goals and win with a can-do attitude.Act with velocity and a strong sense of urgency.Respect cultural diversity and sensitivity.Agility in learning improving and innovating.We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing BenefitsThis role will require an on-site presence.