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Intel Thermal Design Engineer Taiwan, Taipei, Taipei 549670798
Drives end to end thermal design and development from initial concept to fruition ensuring thermal objectives are met.
Designs thermal solutions to address platform energy efficiency and performance scaling.
Defines product power and temperature limits based on system cooling capability and provides thermal parameters for product teams to use for HVM manufacturing.
Conducts thermal analysis, designs, prototypes, and testing for air and liquid cooling solutions at various stages of product life cycle.
Applies deep expertise in conduction, convection (passive and active), radiation, heat sinks, heat pipes, and vapor chambers to perform thermal and pressure drop characterization of cooling solution as a function of flow rates and validates model correlation.
Drives thermal management system, tunes thermal solutions considering thermal interface materials and contact pressure as well as firmware based thermal management policies to achieve maximum performance.
Conducts thermal simulation and analysis that extends to within the silicon, electronic packaging, and PCB, with understanding of the thermal impact of material selection, stackup, design layout, thermal dissipation power map, and transient behavior.
Delivers thermal design reviews and solutions to resolve problems.
Collaborates crossfunctionally with design, power, reliability, electrical, and mechanical teams to understand the platform requirements and constraints.
Drives continuous technical readiness by conducting research, experiments, prototypes, and testing relevant to thermal engineering discipline.
Thermal Simulation for the characterization and development of power modules and SiPs, on package, board and system level
Generation of simulation and compact models for end customers.
Thermal virtual prototyping and simulation based product optimization.
Thermal consulting of internal customers from development and application; close interaction with customers from a problem statement to simulation results interpretation and delivery.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
A degree in Mechanical / Electronics Engineering, Physics or a similar field
At least 6-9 years of professional experience in thermal FEM/ CFD simulations
Very good experience with Ansys Mechanical, Icepak, Simcenter Flotherm or similar tools
Knowledge in creating and modifying 3D CAD geometries for simulation
Ideally experience in simulation of semiconductor or microelectronic devices
Experience in experimental thermal characterization is a plus
An analytical mindset for complex problem-solving
Fluent English language skills
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