Qualcomm Hardware System Engineer Principal 

United States, California, San Diego 

549497722

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

Responsibilities:

• Lead advanced system architecture and design exploration projects focusing on 3-5yr+ disruptive technologies supporting all BU product needs

• Coordinate competitive analysis across hardware systems team to give a comprehensive view supporting each BU and focused technology areas (package design, interfaces, components, technology, etc...)

• Drive system design requirements for advanced technology integration test platforms/chips to ensure Qualcomm is leading and ready to jump to the next revolutionary technologies

Preferred Qualifications:

• Master’s degree / PhD in Science, Engineering, or related field.

• 7-10+ years of professional experience in package design, system architecture and advanced package/system technologies

• In depth experience on advanced package/system technologies such as 2.5D, 3D, embedded components, and other advanced integration technologies

• Experience with chip-to-chip (C2C) and die-to-die system interface architecture and design

• Experience with high bandwidth memory system architecture and technology integration

• Experience with chiplet system architecture and technology integration

Minimum Qualifications:

• Bachelor's degree in Science, Engineering, or related field and 5+ years of package design, system architecture and advanced package/system technologies.

• 5yr+ years of professional experience in package design, system architecture and advanced package/system technologies

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range:

$189,000.00 - $284,000.00