Western Digital Senior Engineer Packaging Engineering 

Philippines, Baguio 

535844952

Defines IC package/SMT/SSD drive requirements, goals, and milestones for all SSD product groups and customer requirements. Develops SSD assembly and IC packaging material and processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements. Develops new package and SMT process qualification programs. Prepares and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies. Plans and conducts experiment to fully characterize material and processes throughout pathfinding to development to ramp. Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity, and safety utilizing formal education, experience, statistical knowledge, and problem-solving tools. Establishes process control systems. Transfers process to high volume manufacturing and provide support in new factory start-up. Acts as a liaison with suppliers/vendors. Maintains product quality while developing and introducing package cost reduction programs. Coordinates the introduction of new package processes into production. Using appropriate tools, performs integrity analysis of packages.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Overall manufacturing process knowledge
• New Product Introduction experience
• SMT process characterization & development
• SMT integration development
• SMT technology (equipment/process/metrology) pathfinding & roadmap
• Stencil design/development for new components
• DFM assessment and risk management
• Component-board-drive interactions
• DOE & Failure Analysis knowledge
• Quality Tools: FMEA, 8D, DMAIC, etc.
• Statistical Tools: Statistical analysis (JMP/Minitab).
• Special engineering characterization, improvement & cost reduction projects
• Factory emergency taskforce support

REQUIRED:

• Degree in Engineering / Computer Science or equivalent.
• Minimum 5 years of working experience in Semiconductor manufacturing environment is desirable.
• Experience or knowledge in product spec qualification.
• Demonstrated track record to rapidly analyse and solve complex engineering issues by pursuing a focused solution path with a clear understanding of the point of diminishing returns.
• Proficient in statistical analysis towards problem solving and the use of Excel and JMP
• Highly self-motivated and self-directed with demonstrated ability to work well with people; have strong inter-cultural intuition.
• Proven success leading technical team(s) in previous work experience.
• Strong verbal and written communications skills

PREFERRED:

• Experience in SMT process, programing or program management is added advantage.
• Ability to work independently and to deliver high quality solutions.

SKILLS:

• Good at 8D report, FMEA, PCP, DMAIC, IPC.
• Ability to work effectively with multi-functional team member, with good communication skills.
• SMT Reflow SME will be added advantage.
• Good verbal and written in English.