Knowledge of heat transfer principles, CFD, or thermal modeling tools (e.g., Ansys Icepak, FloEFD) and familiarity with regulatory standards and testing for thermal performance (e.g., IEC, ASHRAE).
Understanding of EE design and thermal impacts on performance.
Excellent communication and collaboration skills to work across Hardware, Software and Technical Program Manager teams, with the ability to manage multiple projects and meet deadlines in a fast-paced JDM environment.