Nvidia Senior Process Development Engineer - Electro-Optical Packaging 

Israel, North District 

516011327

What you’ll be doing:

• Create advanced optical assembly procedures and recipes.

• Work with machine vendors to develop, customize and accept complicated assembly systems.

• Evaluate and qualify new adhesives, soldering and packaging materials for interconnect products.

• Establish new assembly methods using novel equipment.

• Lead process failure tasks.

• Create Process Transfer package for high-volume manufacturing team and support manufacturing teams during bring up.

• Work involves many hours of laboratory work, and requires long stay near machines and analytical devices.

• You will closely work and collaborate with many other professional teams.

What we need to see:

• B.Sc. or M.Sc. in Material Science and Engineering / Opto-Mechanical Engineering / Physics / Mechanical Engineering / Electrical Engineering.

• 5+ years of experience in R&D department or process engineering in the semiconductor, optics, or PCB industry. Ph.D. candidates will also be considered.

• High capability and understanding of machine software and recipes as well as process integration.

• Self-managed, initiative and innovative.

• Superior problem-solving and presentation skills.

• Teamwork player as well as a sole worker.

• High attention to details.

• High level of written and verbal communication in Hebrew and English.

• Traveling abroad with frequency of one week in a quarter.

Ways to stand out from the crowd:

• Previous experience in R&D teams in semiconductor or optical communication industries.

• Proven experience and deep knowledge in precise assembly machines

• Good understanding and/or modeling skills of optical devices and phenomena (Zemax or equivalent SW tools).

• Programming skills