Required/Minimum Qualifications
- 9+ years of related technical engineering experience
- OR Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience or internship experience
- OR Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience or internship experience
- OR Doctorate degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience
- 8+ years of experience in semiconductor process development and manufacturing.
- 5+ years of experience in and technology evaluation, testchip and modeling
- 5+ years of experience in device physics, foundry design collateral, process qualification, broad fabrication process experience, device reliability, statistical analysis, yield improvement, and physical failure analysis techniques.
- 5+ years of experience in Testchip design experience including test structure definition, schematics and layout design, SPICE simulation, functional verification and test implementation
Other Requirements
- Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
Preferred Qualifications
- Experience with device-level measurements and associated test equipment, data analysis, modeling, simulation, targeting and projection
- Probability and statistics background, including DOE’s
- Experience inLeading cross-functional teams and understands program/project management.
- Proficient in product yield/performance analysis, and design technology co-optimization.
- Model based problem-solving skills through data analysis and understanding of SOC design features, FAB process interactions and test methodology.
- EDA tools from Cadence, Synopsys, Siemens for device and IP study.
- Proficient in data analysis tools like excel, JMP, etc.
- Custom process and custom library development
- Product and test engineering, and ATE test program methodologies
- SPICE model development
- Analog design with automation and script; proficient with latest mixed-signal design flows and tools
- Digital design knowledge in floor planning, STA; taking RTL to GDS and optimize for PPA
- Knowledgeable in
- Coding using various languages including but not limited to Python, Java and C++.
- Leveraging and designing/optimizing AI/ML.
- DFT and DFM techniques.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:Microsoft will accept applications for the role until August 15, 2024.