1, Good DACA Process development experience on DFN packages.在DFN封装类型上具备良好的DACA工艺开发经验。
2, Well know about MOSFET overall assembly stations, experience on Die Attach & Clip Attach; Flux cleaning; Reflow curing process andequipment熟悉MOSFET全封装流程,具备晶粒粘贴、铜夹片粘贴、助焊剂清洗、回焊焊固化等工艺和设备经验。
3, Has Die Attach & Clip Attach; Flux cleaning; Reflow curing machine procurement and specification experience or skill.具备晶粒粘贴、铜夹片粘贴、助焊剂清洗、回焊炉固化等设备采购和规格书撰写经验或能力。
4, For totally new machine setup; buyoff and release to mass production experience or skill.具备全新设备的设置、验收和释放量产的经验或能力。
5, Good acknowledge about: lead frame technical; soft solder material; die bond curing process; Flux cleaning technical and chemical property.关于:引线框架技术;软焊料(锡膏)技术;晶粒粘贴后烘烤;
6, Good engineering analysis and logical mindset to solve the trouble shooting.良好的工程分析和逻辑思维以便于解决产线问题解决。
7, Strongly logical and engineering capabilities for wafer incoming; wafer saw and wafer mount process and UV process effective; DACA process failure analysis.有较强的逻辑和工程分析能力应对晶圆来料坏品、晶圆切割及晶圆贴胶纸和UV解胶工序的影响。DACA工序失效分析。
8, Able to define Process and system document asWI/SOP/OCAP/PFMEA/DFMEA定义工艺及系统文件如操作指引、流程标准、OCAP、工艺&设计失效模式与影响分析等。
9, DOE and parameter optimization project experience. DOE和参数优化项目经验。
10, Machine key parts safety storage definition; lifetime validation; qualification and cost reduction.设备关键部件安全库存的建立;寿命评估;验收和成本节约。
11, To editable 8D report and short-term, mid-term and long-term actiondefinition具备8D报告的撰写能力及短期、中期、长期改善行动定义。
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