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Apple Packaging Engineer SiP & Component Productization Vietnam, Hanoi 397174055
07.04.2025
- Conduct technology risk assessments and lead process/product qualifications- Establish design rules, implement process DOE (Design of Experiments), and optimize processes- Ensure proper in-line controls and SPC (Statistical Process Control) implementation before production ramp-up- Generate yield analysis, risk assessments, root cause analysis, and resolve quality issues- Work as a supplier quality development engineer, acting as a manufacturing site/ products owner
- Ideal candidate should have around 8 to 15 years of experience in products or process development in Semiconductor IC Packaging Engineering.
- Bachelor’s or master’s degree in engineering, Physics, or Material Science related fields.
- Strong communication skills, with proficiency in spoken and written English
- Demonstrated problem solving skill and leadership skills.
- Experience in managing a team or experience in Assembly R&D team
- Additionally, expertise in diverse area such as materials, wafer DPS, wafer bumping, manufacturing, or quality engineering would be highly beneficial.
- A team player who is self-motivated, result oriented and detail driven
- Willingness to travel across Asia to provide engineering support
- Experience in AIML and lean factory would be a big plus, or Knowledge in deep learning (DL) or statistical machine learning (ML) is preferred.
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