Qualcomm HW Design Applications Engineer 

India, Karnataka, Bengaluru 

293523226

Job Area:

Engineering Group, Engineering Group > Hardware Engineering

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.

Minimum Qualifications:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.

Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.

PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.

Job Function

Job Description

· Experience in designing industry Standard form factor modules like SMARC, COM Express, COM HPC, Single Sided LGA, OSM etc · Proficient in schematic capture tools like OrCAD and Siemens Mentor Graphics Designer. · Proficient in PCB layout tools like Cadence Allegro and Siemens Mentor Graphics Expedition. · Proficient in Power Distribution Network (PDN) methodologies and schemes. · Proficient in routing topologies for PC-DDR, DDR, and termination schemes. · Proficient in routing schemes of high-speed interfaces like USB 3, PCIe 3+, Ethernet (1 Gbps or higher) and other SERDES interfaces

· Knowledge of high-speed simulation tools like Ansys Q3D, Cadence Sigrity, and Sentinel is necessary ·

Hands on knowledge of running PDN (power distribution network) simulations of a PCB is desired

Experience in analog, power, digital, and RF PCB layout aspects. · Hands-on experience with multilayer PCBs (at least 12 layers, at least 10 cm x 10 cm, with a processor or FPGA having > 500 pins and pitch smaller than 0.5 mm) and upto 2.00mm thickness.

· Knowledge of PCB layout tools like Altium Designer and Mentor PADS is a plus. · Knowledge of thermal impacts and mechanical constraints on a PCB. · Experience in documenting PCB guidelines, checklists, and rules. Candidate should have 5-8 years of relevant experience. Past expertise in interacting with multiple teams in HW, domain skills in Digital/High Speed/SoC is desirable.

Hands-on with electrical test & measurement equipments like oscilloscopes, power supplies, multimeters, data loggers are a plus

Exposure to general purpose prototyping platforms like Arduino, Raspberry Pi are a plus

Preferred Qualifications

Sound understanding of HW and PCB design. · Strong understanding of signal integrity and electromagnetic compatibility (EMC) principles. · Experience with Design for Manufacturability (DFM) and Design for Testability (DFT) practices. · Familiarity with IPC standards for PCB design and manufacturing.

· Ability to perform design reviews and provide constructive feedback. · Excellent problem-solving skills and attention to detail. · Effective communication skills for collaborating with cross-functional teams. · Ability to manage multiple projects and meet deadlines.

Keywords ·

PCB Board Design, Modules, PCB CAD, SMPS, LDO, Antenna, SMARC, COM Express, COM HPC, Single Sided LGA, OSM, HPCMini

Educational Requirements Required:

Bachelor's, Electronics and/or Electrical Engineering

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.