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Apple IC Packaging Engineer Characterization Simulation 
United States, California 
273582596

16.05.2024
Key Qualifications
  • BS and 3+ years of relevant industry experience.
  • Shown training in mechanics and materials science and experience of experimental mechanics and material characterization.
  • Shown capability of setting up equipment and data acquisition systems.
  • Hands-on experience of major material analysis and failure analysis tools (e.g., SEM, EDX, FIB, CSAM, etc.) is helpful.
  • Familiar with numerical simulation software tools and confident in programming of MATLAB and/or Scientific Python.
  • Knowledge of electronic packaging structures, processes and the reliability of electronic packages, package qualification requirements as well as its materials (solders, polymers, etc.) and their mechanical behaviors.
  • Able to perform independent research and development work.
  • Excellent written and verbal communication skills with ability to present ideas, data, and plans with high confidence at team meetings.
Description
- Characterizing component packages under various environmental and reliability testing conditions, such as mechanical loading, thermal and moisture stressing.- Characterizing key packaging materials and supervising material characterization activities at suppliers.- Developing characterization methodologies for IC packages and related materials, including setting up equipment and building proper fixtures for the test.- Working on trouble-shooting activities of packaging-related failures.
Education & Experience
- BS and 3+ years of relevant industry experience.
Pay & Benefits
  • At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $138,900.00 and $256,500.00, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.