Qualcomm SIPI Engineer Senior 

Taiwan, Hsinchu 

26838347

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

The responsibilities will include but not be limited to the following:

• Perform package extraction for the time domain and frequency domain analysis

• Perform system-level analysis for DDR, SerDes & Mixed signal interfaces

• Provide design guidelines for the Package design

• Develop design & analysis flow and automate the process

• Create technical documentation and presentations

Minimum Qualifications:

• 3+ years of experience in DDR/SerDes in Package/PCB/System Design related to mobile standards

• Experience in Electromagnetics and solid background on transmission line theory & Crosstalk

• Proficiency in field solvers such as HFSS, Q3D, Sentinel-PSI and Clarity

• Experience in simulation tools such as ADS and Hspice

• Working knowledge in Cadence Allegro/APD/Sip or Mentor Xpedition

Preferred Qualifications:

• Experience in programming language(c/c++) or scripting language(Perl/Python) is a plus

• Experience in Matlab to be able to automate existing simulation flow

• Experience in design specifications such as LPDDRx, MIPI(CSI, DSI), PCIe , UFS

• Master Degree with 3 4 years of experiences is preferred, Ph.D with minimal experience is considered as well

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.