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Nvidia Senior Signal Power Integrity Engineer 
China, Macau, Macau 
225702142

Today
Taiwan, Taipei
China, Shenzhen
time type
Full time
posted on
Posted 10 Days Ago
job requisition id

What you'll be doing:

  • Drive board/system level signal and power integrity requirements

  • Lead board/system SI/PI design activities, including PCB stackup/material selection, design guide implementation, layout review, and post-layout analysis

  • Work closely with Architecture, ASIC, Mixed Signal, Package, and PCB Design teams to design and ensure system SI/PI performance meets expectation before Gerber out, also work closely with Design Validation teams to support SI/PI failure analysis

  • Develop novel algorithms & new methodologies to improve SI/PI modeling efforts

  • Work with Application Engineering teams to support customers w/ SI/PI questions

  • VNA & TDR measurements to support model correlation efforts and improve confidence in design stage

What we need to see:

  • MS/BS in EE or equivalent experience

  • Minimum 5+ years of experience as a SI/PI engineer

  • Deep understanding of electromagnetics, specifically electromagnetic waves including transmission line theory and via properties

  • Proficient with HFSS, Sigrity, Hspice, and/or other simulation tools

  • Experienced with Cadence Allegro PCB designer and Constraints Manager

  • Understanding of high volume manufacturing variations and impact to channel signal integrity

  • Exposure to lab measurements including VNA & TDR experience

  • Passionate about SI/PI work

  • Good written & verbal interpersonal skills in English

Ways to stand out from the crowd:

  • Familiarity with NRZ/PAM-4/Duo-binary signaling schemes

  • Exposure to interface timing budgets and system modeling

  • Familiarity with high-speed I/O design concepts including clock generation, transmitter & receiver design, and equalization schemes

  • PDN analyses including model generation and time domain simulation

  • Experience w/ Matlab, Python, and C as well as exposure to package design