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Cisco Mechanical Engineer Taiwan, Taipei, Taipei 179059104
18.11.2024
What You'll Do
- Develop advanced FCBGA packaging solutions (2.5D, fanout) for next gen semiconductor ICs.
- Assess advanced packaging trends and select technology and partners for productization.
- Define thermal and mechanical requirements for new package configurations to select materials, processes, and work with OSAT partners.
- Plan and execute test vehicle DOE, test vehicle characterization, qualification to optimize assembly process, select materials & partners and establish device manufacturability and reliability.
- Establish design rules for package envelopes by combining modeling and test vehicle characterization data.
- Manage product assembly setup, inline metrology and quality controls and perform reliability testing.
- Manage substrate and OSAT vendors to ensure smooth product NPI and transition to HVM.
Who You Are
Minimum Qualification:
- 10+ years industry experience.
- MS in Mechanical Engineering/Material Science or related fields.
- Experience with advanced package technology development and NPI including 2.5D and fanout technologies.
Preferred Qualification:
- Ability to drive the package-based design rules.
- Knowledge of alternate packaging technologies such as ceramic packaging or glass core-based packaging is a plus.
Why You’ll Love Cisco
- We connect everything – people, process, data and things – and we use those connections to change our world for the better.
- We benefit everyone - We do all of this while striving for a culture that empowers every person to be the difference, at work and in our communities.
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