Applied Materials College Intern 

Singapore, Singapore 

164667232

Metal electroplating for advanced semiconductor packaging application

Rapid development of high-performance computing and artificial intelligence drive the demand for advanced semiconductor packaging, to enable integration of diverse components into a single device to achieve high performance and efficiency. Plating innovations are needed in participant the technology inflections for Advanced Packaging including high-speed plating, scaling for high-density module, and additive control to enable low temperature hybrid-bonding.