Amazon Principal IC Package & Assembly Technology 

Israel, Haifa District, Haifa 

136414526

We offer a dynamic, open, teamwork environment operating at high pace mode.Key job responsibilities– Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurna’s products.
– Engage with substrate and assembly vendors on future technologies roadmap.
• Product development and manufacturing:– Assume full ownership of mechanical and thermal performance of Annapurna ICs.
– Work with Assembly, Test and Logistics to define work flows at OSATs (focus on Fab/assembly/test interfaces)
– Track assembly and substrate yields and look for ways to improve them.

• 10+ years of professional experience in similar role.
• B.Sc. or M.Sc. degree in Electrical Engineering, Applied Physics or related fields.

• Dive deep quickly into unfamiliar domains
• Strong analytic and problem-solving skills
• Ability to work independently on multiple issues.