Intel Product Failure Analysis Engineer 

Malaysia, Penang 

123408318

In this position, you will be performing Failure Analysis and root cause analysis on Intel SoC, CPU, Chipsets and Netcomm platform products. This includes PC system and/or tester testing and analysis to isolate the failing instruction and internal signal, applying circuit analysis and various device localization equipment and techniques to localize the failing circuitries and performing physical failure analysis to locate the defect. Your responsibilities will include but not be limited to

1. Responsible for improving product yield, quality and reliability through the recommendation of corrective actions to counterparts in Fab and Assembly and Test for root cause fix

2. Participating in new product and/or technology transfer and startup, enabling automation and improvement on the failure analysis process, tools and methodology, developing new FA techniques and proliferating learning across sites

You must possess a Master's or a Bachelor's degree in Electrical, Electronics, or Microelectronics. Additional qualifications include

1. Excellent verbal and written communication skills

2. Ability to work well in a diverse team environment

3. Good knowledge in one or more of these areas would be an added advantage:

• Device physics, I/O structure, VLSI, Digital & Analog Design, Perl/Python/C programming, Fabrication process, microprocessor architecture and micro architecture, microprocessor circuit, assembly language and IA-32, SCAN & Cache architecture & DFT (Design for Testability)

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits