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Texas Instruments Packaging Engineering Intern 
Taiwan, New Taipei 
113510691

20.03.2025
Taipei City, Taiwan

Minimum Requirements:

  • Currently pursuing an Bachelors degree in Mechanical Engineering, Materials Science, Chemical Engineering, Physics or Electrical Engineering.
  • Cumulative 3.0/4.0 GPA or higher

Preferred Qualifications:

  • Semiconductor packaging knowledge is preferred (processes, assembly, reliability, materials, characterization, FA)
  • Demonstrated analytical and problem solving skills
  • Strong written and verbal communication skills
  • Ability to work in teams and collaborate effectively with people in different functions
  • Strong time management skills that enable on-time project delivery
  • Ability to build strong, influential relationships
  • Ability to work effectively in a fast-paced and rapidly changing environment
  • Ability to take the initiative and drive for results
Why TI?
  • Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
  • We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours.
  • Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.
If you are interested in this position, please apply to this requisition.
TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.
Job Info
  • 240003OB
  • Job CategoryEngineering - Product Dev
  • Posting Date12/12/2024, 08:12 PM
  • Degree LevelHigh School Graduate
  • LocationsTAIP 13F, Hung Tai Center, 168 Dun Hua North Road, Taipei, 10548, TW
  • ECL/GTC Required

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