דרושים Vice President Manufacturing Product Engineering Mpe ב-אינטל ב-ארהב

Strategic Planning & Development

• Design and manage end-to-end customer samples plans and activities for specific products or product groups

• Develop, document, and implement standardized sampling procedures and methodologies

• Identify and establish critical quality control checkpoints throughout sampling processes

Stakeholder Management & Communication

• Act as primary interface with internal stakeholders and leadership across all project phases

• Participate in management review committees and strategic decision forums

• Own all customer communications related to sampling programs

Cross-Functional Coordination

• Manage interdependencies and communicate sampling plans to business partners

• Collaborate with Product Development Teams (PDTs) and Management Review Committees (MRCs)

• Coordinate with quality assurance teams to ensure sampling integrity

Data-Driven Decision Making

• Apply advanced data analytics and business intelligence to optimize sample allocation

• Make complex allocation decisions balancing division priorities with constrained supply

• Utilize experiential data to improve sampling efficiency and customer satisfaction

• Assess program risks and develop mitigation strategies to meet timeline and quality objectives

Behavioral Traits

• Strong analytical and problem-solving skills

• Excellent communication and stakeholder management capabilities

Minimum Qualifications

• Bachelor's Degree in Supply Chain Management or similar field

• 4+ years of relevant experience in supply chain, product planning, or related field

• Experience with manufacturing processes, supply chain management

Preferred Qualifications

• Experience with Power BI dashboarding and advanced Microsoft Excel functionality

• Experience with Intel-specific tools including:

  • My Samples

  • SPEED/IDET

  • ISM (Intel Sample Management)

• Data analytics and business intelligence experience

• Experience in semiconductor or technology supply chain management

• Project management certification or experience

Experienced HireShift 1 (United States of America)US, Oregon, Hillsboro
Position of Trust

offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in the US:

Job Description:

• Lead and manage a team of silicon physical design engineers responsible for end-to-end silicon design engineering activities supporting technology development, and product design execution on EMIB 2.5D/3.5D, Foveros S/R/B, and Foveros Direct 3D Intel foundry advanced packaging technologies.

• Oversee planning, scheduling, and execution of design projects, ensuring milestones and deadlines are met.

• Drive continuous improvement in design methodologies, flows, and processes to enhance quality and efficiency.

• Collaborate with cross-functional teams (technology partners, packaging, analysis, and verification) to ensure seamless integration and manufacturability.

• Provide technical leadership and mentorship, fostering a culture of innovation and accountability.

• Responsible for enabling teams to execute through clear goal setting, facilitating work, maintaining accountability, applying differentiated performance management, and driving team results.

• Drives results by inspiring people, role modeling Intel values, developing the capabilities of others, and ensuring a productive work environment.

Key Responsibilities:

Leadership and Management

• Lead and manage a group of Silicon Packaging Engineers, providing guidance, mentorship, and support to ensure the successful execution of projects.

• Oversee the planning, scheduling, and execution of package design projects, ensuring that milestones and deadlines are met.

• Foster a collaborative and innovative team environment, encouraging continuous learning and professional development.

• Lead design groups, coordinating efforts across multiple teams to achieve project goals.

Technical Expertise

• Serve as the technical lead for the package design team cross multiple products.

• Drive the development of advanced packaging designs, ensuring compliance with industry standards and best practices.

• Collaborate with cross-functional teams, including package architects, silicon and board design teams, design rule owners, electrical analysis engineers, and integration teams to define and implement design specifications.

• Leverage extensive experience in advanced packaging designs to meet design KPIs.

• Influence.

• Ensure products are designed and developed with high quality standards by overseeing design processes, risk management, and compliance throughout the product design lifecycle, working closely with cross-functional teams to identify and address potential quality issues before they arise.

Project Management

• Develop and maintain detailed project plans, including resource allocation, risk management, and progress tracking.

• Coordinate with stakeholders to ensure alignment on project goals, deliverables, and timelines.

• Conduct regular project reviews and provide status updates to senior management.

Innovation and Improvement

• Identify and implement process improvements to enhance the efficiency and quality of package designs and development.

• Stay current with industry trends and emerging technologies, incorporating new methodologies and tools into the design process.

• Drive innovation in product design, exploring new approaches and techniques to achieve competitive advantages.

The ideal candidate should exhibit the following behavioral traits:

• Excellent leadership and team management skills, with the ability to inspire and motivate a diverse team of engineers.

• Strong project management skills, with the ability to manage multiple projects simultaneously and meet deadlines.

• Exceptional problem-solving and analytical skills, with a keen attention to detail.

• Excellent communication and interpersonal skills, with the ability to collaborate effectively with cross-functional teams and stakeholders.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• Bachelor's degree in Electrical Engineeringor STEM related field with 9+years of relevant experience

• -OR- Master's degree in Electrical Engineeringor STEM related fieldwith 6+ years ofrelevant experience

• -OR- PhD in Electrical Engineeringor STEM related fieldwith 4+ years of relevant experience

Relevant experience should include the following:

• Experience in silicon design, with at least 3 years in a leadership role.

• Proven experience in a leadership or management role, with a track record of successfully leading engineering teams and delivering complex projects withinestablished timelines.

• Experience with design flows and methodologies (physical design, verification).

• Experience working with EDA tools from Cadence, Synopsys, and/or Siemens.

Preferred Qualifications:

• Experience with advanced nodes and packaging technologies

• Experience in RTL2GDS flows and methodologies

Experienced HireShift 1 (United States of America)US, Arizona, PhoenixUS, Oregon, Hillsboro
Position of Trust

Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in the US:

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

Responsibilities for this position include, but are not limited to:

• Appliesengineering/technical

• Applies advanced engineering knowledge of Intel and industry technology roadmaps, and technical knowledge of commodities to drive supply chain solutions ahead of Intel's needs.

• Develops supply chain solutions that are tailored to unique Intel development needs for complex situations and products.

• Leverages strong understanding of technology, contracting, negotiating, risk mitigation and supplier relationship management to manage supplier relationships, and provide sustainable cost, quality, availability, and technology solutions with adherence to procurement policies.

• Coordinates purchasing activities with cross-functional teams to acquire materials and services in a cost effective and timely manner.

• Ensures respective commodities meet technical specifications and cost requirements for Intel to develop products/services.

• Works closely with engineering teams and suppliers to define standard and custom product requirements, influences technical design decisions, negotiates technical contract terms with suppliers to meet technical specifications and fulfil business objectives.

• Conducts periodic reviews of commodity sourcing strategies in partnership with engineering teams/customers to shape strategic business objectives and account investments through aligned roadmaps.

• Reviews and pivots sourcing strategies in response to changing market conditions and develops mitigation plans to ensure business continuity.

• Works closely with finance and legal to resolve disputes with suppliers/internal partners.

• Leads sustainability and regularly compliance and ensures suppliers comply with Intel business processes.

• Understands Intel's technical roadmap and positions the supply chain to meet Intel's needs including alignment tosafety/availability/quality/sustainabilityframework.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Bachelor’s degree in Engineering, Material Science, Supply Chain Management, or related field with 8+ years relevant experience

— or —

Master’s degree in the same fields with 6+ years of relevant experience

— or —

PhD in the same fields with 4+ years relevant experience

Relevant work experience should be of the following:

• Experience with Supply line and Capacity Management Planning

• Experience with Semiconductor substrate manufacturing, supplier capability analysis and capacity expansion requirements

• Experience with overall semiconductor packaging and advanced packaging requirements

Preferred Qualifications:

• Engineering experience in manufacturing and/or supplier management

• Experience in program management and setting technical recommendations and requirements

Experienced HireShift 1 (United States of America)US, Arizona, PhoenixUS, California, Santa Clara, US, Oregon, Hillsboro
Position of Trust

Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in the US:

Join Intel and build a better tomorrow Intel is looking for awesome students who want to help create the next generation of technologies that will shape the future for decades to come. Intel Fab 25 offers you a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. We give you opportunities to transform technology and create a better future by delivering amazing products and meeting emerging technological needs. You will be in a fast-paced and challenging environment performing functions associated with Wafer movement within the Oregon Factory. What You'll Gain: • Comprehensive knowledge about semiconductor fabrication plants known as Intel "Fabs." • Practical skills and hands-on experience with manufacturing tools and equipment. • A coveted experience with a leading semiconductor manufacturer, enhancing your credentials. This is a 2-year program and part-time position. Working hours will be 20-32 hours a week during the school year and up to 40 hours a week on breaks/summers; with flexible hours around a student's school schedule while still in alignment with one of the following factory shifts: • Shift 5: (Day): Sunday through Tuesday (every other Wednesday) 7:30 AM to 8:00 PM • Shift 7: (Day): Thursday through Saturday (every other Wednesday) 7:30 AM to 8:00 PM What You'll Do (and more): • The position will be hands-on, training on-site with factory floor presence. • Perform functions associated with all wafer production including operations, equipment, process, and training. • Run product in a safe and qualitative manner, multi-tasking, following procedures while executing to output goals. • Equipment maintenance, repair, troubleshooting, defect reduction, and other duties as required, supporting fab objectives. • Work from technical manuals, specifications, drawings/diagrams, and schematics, as well as follow, comprehend, and complete verbal and written instructions and procedures. • Deliver clear and concise status updates to peers and participate in resolving sustaining issues. • Communicate with people at different levels of the organization including module technicians, managers, engineers, and others as needed. Expectations: • Must be willing to lift 25 lbs. This position requires frequent standing, walking, bending, and reaching. • Spend most of the work time (more than 90 percent less break time) in a clean room environment working on equipment, processing wafers, and standing or sitting for extended periods of time. • Work in a clean room environment wearing a gown, hood, booties, safety glasses, and gloves for the duration of the shift. • Perform Preventative Maintenance or troubleshooting on production equipment. • Perform detailed visual inspection tasks. • Use job-specific fixtures, basic hand tools, and potentially airline-supplied respirators.Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience. This position is not eligible for Intel immigration sponsorship. Minimum Requirements: • Currently enrolled in second year Microelectronics program pursuing an associate degree, Technical, orfields, with successful completion of foundational courses.• Available to work a minimum of 20 hours per week during factory operations. We offer flexible scheduling across day and night shifts with compressed work weeks (12-hour shifts, 3-4 days per week) to accommodate various life circumstancesPreferred Qualifications: • Completion of your first year Microelectronics courses preferably with a minimum 3.0 GPA.• Basic knowledge in any of the following areas: electronics, equipment troubleshooting, installation, repair, and operations. • Experience performing hands-on work such as auto repair, welding, soldering, robotics, and crafting. We encourage applications from candidates of all backgrounds who demonstrate: Problem-solving abilities, troubleshooting and technical aptitude • Willingness to learn and grow in a semiconductor manufacturing environment • Commitment to safety and quality standardsWorking Model This role will require an on-site presence.Shift 5 (United States of America)US, Oregon, Hillsboro
Position of Trust

offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in the US:

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

Job Description:

Note: This role requires regular onsite presence to fulfill essential job responsibilities. Performs feasibility studies and provides integrated process solutions to meet desired safety, quality, reliability and output requirements for ultimate transfer to high volume manufacturing. Selects and develops material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Plans and conducts experiments to fully characterize the process throughout the development cycle and to improve performance for each specific product. Identifies integrated process solutions to resolve issues or specific requests from customers by partnering with innovators in product engineering and module engineering teams. Conducts new product qualification and technology transfers from fabrication operations. Leverages big data analysis to identify process design weaknesses and/or manufacturing tool issues and proposes corrective, data-based solutions. Collaborates and engages with development and material suppliers, and partners to develop processes and equipment needs to meet technology roadmaps. As a principal engineer, recognized as a domain expert who influences and drives technical direction across Intel and industry. Develops and mentors other technical leaders, grows the community, acts as a change agent, and role models Intel values. Aligns organizational goals with technical vision, formulates technical strategy to deliver leadership solutions, and demonstrates a track record of relentless execution in bringing products and technologies to market.

Qualifications:

Bachelor's degree inElectrical/ElectronicEngineering, &/or Computer Engineering, or Science, or other STEM-related degree and 7 years of progressively related experience.

Alternatively, Master's degree inElectrical/ElectronicEngineering, &/or Computer Engineering, or Science, or other STEM-related degree and 5 years of progressively related experience.

Shift 1 (United States of America)US, Arizona, Phoenix
Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in the US:

Job Description:

development engineers to drive technology development and enablementacross the full range of patterning modules for advanced CMOS technologies

be responsible fordevelopment and drivingmanufacturability across key lithography tools includingbut not limited to DUV

Primary responsibilities willat the intersection of technology developmenthigh volumeespecially on new lithography processesthat require engineering to meet high volume requirements.

This includes driving safety,quality, performance, throughput, capability (patternand cost.

high volumeand will be

and develop the engineer

The leader will be asubject matter expert and have experience working with Integration and othermodules leaders such as etch and thin films to deliver modular solutionsthat meet the technology targets.

Qualifications:

Minimum qualifications areto be initially considered for this position. Preferred qualifications are in addition to therequirements and are considered a plus factor inMinimum Qualifications:
14 years of relevant work experience in the semiconductor spacewith a strong focus on lithography
Degree in Electrical Engineering or Technical Equivalent
Prior senior management with large, multi-national manufacturing employers, preferably in hightechnology/scientific/semiconductorsectors with prior specialization in technology development.
Strong history of industry experience in process development, leadership, and semiconductor
Background working with a combination of investors and third- party suppliers on solutionoptimization/customizationto meet their manufacturing needsespecially with the industry leaders in lithography solutionssuch as ASML and KT.
Engineering group leader background at global scale including leading significant factory ramp-up and process technology development in high volume manufacturing environments.
Extensive experience instart-up with technicaltrack recordin multiple areas of semi-conductor sector in areas such as manufacturing engineering, quality and reliability, research and development, sourcing/supply chain innovations etc.Preferred Qualifications
Substantial technical background inlithography as used in advanced CMOS technologieswith a body of research and patents.Demonstrated history of delivering customized solutions in Research and Development and HVM organizations.related work experience in a semiconductor foundry preferredRequirements listed would be obtained through a combination of industry relevant job experience, internship

Experienced HireShift 1 (United States of America)US, Arizona, PhoenixUS, Oregon, Hillsboro
Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in the US:

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

Job Description:

• Drive Design for Manufacturability (DFM) strategies across CMOS technology platforms supporting high performance compute, mobile, mixed signal, memory controllers, and other broad market applications

• Develop and implement advanced DTCO methodologies including design rule optimization, process-aware design guidelines, andmanufacturing-friendlydesign practices for versatile logic technologies

• Collaborate with design teams, process engineers, and foundry customers across multiple market segments to establish optimal design-technology interfaces and co-optimization strategies

• Lead cross-functional DTCO teams to translate diverse customer requirements into manufacturable solutions while optimizing yield, performance, and cost across various application domains

• Drive the development of next-generation DFM tools and methodologies ensuring compatibility with Intel's existing manufacturing processes and advanced node platforms for general-purpose logic applications

• Establish and maintain DTCO design rules and guidelines for complex technology nodes serving multiple markets, including advanced patterning, device optimization, and interconnect strategies

• Provide senior technical leadership and mentorship to engineers and researchers in DTCO best practices, fostering innovation in design-manufacturing co-optimization for broad-spectrum applications

• Stay at the forefront of industry DTCO trends, emerging design-technology interfaces, and advanced manufacturing techniques to inform optimization strategies across diverse market segments

Creates next generation device and interconnect technology by ensuring the process device performance for developing processes is world class, using deep understanding of device physics.

Evaluates device performance data, using statistics, data mining, and other data analysis techniques to collect, explore and extract insights from electrical test and process yield data.

• 7+ years of experience in DTCO and/or DFM within semiconductor foundry or advanced technology development environment with an overall minimum of 15 years of experience in the semiconductor foundry industry

• Deep expertise in general-purpose logic CMOS technology DTCO, with experience supporting diverse applications including high performance compute, mobile, mixed signal, and memory controller technologies

• Proven track record in foundry environment developing and implementing DTCO solutions for varied customer requirements across multiple market segments

• Strong background in design-process co-optimization including experience with advanced node challenges (7nm and below preferred) for general-purpose logic applications

• Extensive knowledge of manufacturing processes and DFM principles with hands-on experience in large volume manufacturing optimization for diverse product portfolios

• Required exposure to foundry ecosystem with understanding of customer design flows and manufacturing constraints across various application domains

• Demonstrated leadership experience in driving cross-functional DTCO teams and complex technology development programs serving multiple markets

• Excellent communication and collaboration skills with ability to interface effectively with design teams, process engineers, and external customers from diverse industry segments

• Advanced degree (MS/PhD) in Electrical Engineering, Materials Science, or related field with focus on semiconductor technology

• Experience with EDA tools for DTCO analysis and optimization across multiple application domains

• Knowledge of advanced patterning techniques (EUV, multi-patterning) and their design implications for general-purpose logic

• Background in yield optimization and statistical process control for diverse product mix

• Experience with machine learning applications in DTCO and DFM

• Understanding of various design methodologies for high performance compute, mobile, and mixed signal applications

Experienced HireShift 1 (United States of America)US, California, Santa ClaraUS, Arizona, Phoenix, US, Oregon, Hillsboro
Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in the US: