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Product Packaging Engineer Intern jobs at Intel in Taiwan, Hsinchu
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חברה (1)
אופי המשרה
קטגוריות תפקיד
שם תפקיד (1)
Taiwan
Hsinchu
נמצאו 8 משרות
22.06.2024
I
Intel Product Packaging Engineer Intern Taiwan, Taiwan Province, Hsinchu
תיאור:פרטי המשרה המלאים
Intel advanced packaging technology pathfinding project management. Integration of packaging processes/designs/simulation/test/reliability/Failure Analysis(FA) according to Intel biz process. With a valid in-school student status. Currently in 3rd/4thyear of college or 2ndyear...
משרות נוספות שיכולות לעניין אותך
24.06.2024
I
Intel Logistic Data Analyst Intern Taiwan, Taiwan Province, Hsinchu
תיאור:פרטי המשרה המלאים
The candidate must be an active student currently pursuing a degree in Data Analytics, Data Science, supply chain management or logistic operationMinimum Qualifications: o Python Programming, SQL, R/RStudio, Power BI...
23.06.2024
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Intel Global Yield Device Integration Engineer Taiwan, Taiwan Province, Hsinchu
תיאור:פרטי המשרה המלאים
This job requisition is to seek a Principal Engineer in the Device Integration team in the FSM HVM Global Yield organization, reporting to the Director of Device Integration Engineering. The...
22.06.2024
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Intel Yield Analysis Engineer Taiwan, Taiwan Province, Hsinchu
תיאור:פרטי המשרה המלאים
Bachelor's degree in science and engineering major. 10+ years' experience in advanced node semiconductor industry in in yield analysis and data science. Level of experience will be considered in determining...
22.06.2024
I
Intel Global Yield Defect Reduction Senior Development Engineer Taiwan, Taiwan Province, Hsinchu
תיאור:פרטי המשרה המלאים
Problem-solving and project/program management experience with strong self-initiative and self-learning capabilities. Demonstrated interpersonal skills to perform at leadership role including influencing, engaging, and motivating. Proven track record of working across...
22.06.2024
I
Intel Global Yield BEOL Senior Process Integration Development Eng... Taiwan, Taiwan Province, Hsinchu
תיאור:פרטי המשרה המלאים
Own engineering projects to execute HVM yield roadmap, device targeting and attain performance targets. Collaborate with Technology Development and Local Yield teams to import new technology to production fabs. Work...
22.06.2024
I
Intel BEOL Back-End-Of-Line Integration Principal Engineer Taiwan, Taiwan Province, Hsinchu
תיאור:פרטי המשרה המלאים
Master's or Ph.D. in Electrical Engineering, Physics or Materials Science major. 15+ years of engineering experience in advanced node semiconductor industry in Cu BEOL Process and Integration. 10+ years of...
תיאור:פרטי המשרה המלאים
Intel advanced packaging technology pathfinding project management. Integration of packaging processes/designs/simulation/test/reliability/Failure Analysis(FA) according to Intel biz process. With a valid in-school student status. Currently in 3rd/4thyear of college or 2ndyear...
משרות נוספות שיכולות לעניין אותך
Find your dream job in the high tech industry with Expoint. With our platform you can easily search for Product Packaging Engineer Intern opportunities at Intel in Taiwan, Hsinchu. Whether you're seeking a new challenge or looking to work with a specific organization in a specific role, Expoint makes it easy to find your perfect job match. Connect with top companies in your desired area and advance your career in the high tech field. Sign up today and take the next step in your career journey with Expoint.