דרושים Packaging Operator

Job Description:

• Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.

• Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.

• The ideal candidate will have to drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs.

• The team leverages both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids.

• The team typically uses a combination of simulations and experiments, as needed, to help solve practical engineering problems.

• The team frequently leverages advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches.

Note:This role requires regular onsite presence to fulfill essential job responsibilities. Provides tactical and strategic operational support to ensure the successful development and ramp of a high volume or technology development fabrication facility.

The ideal candidate should exhibit the following skills or behavioral traits:

• Demonstrated ability to work seamlessly between experiments and simulations.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and orschoolwork/classes/research.

Minimum Qualifications:

• Master's Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics and 3+ years of relevant experience
• -OR- PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related fieldwith emphasis in solid mechanics

offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

We are seeking an experienced NPI Transfer Manager to lead new product introduction and technology transfer initiatives from concept through production qualification. This role serves as the primary interface between ourAdvanced Packaging Technology and Development
Key Responsibilities
1. NPI Leadership and Execution

• Lead comprehensive New Product Introduction (NPI) and technology introduction processes from early engagement planning through sample generation, Product Release Qualification (PRQ), and transfer certification
• Demonstrate strong leadership capabilities to drive teams forward during ambiguous situations, resolve competing priorities, and logically balance NPI loading across the network with high product and technology variation
• Formalize business processes to facilitate resource mobilization and close competency gaps, achieving both efficiency and effectiveness across operations and product/package platforms

2. Cross-Functional Collaboration

• Foster strategic collaboration with Division teams, Technology Development, and supply chain organizations that contribute to transfer success
• Partner with Technology Development (TD), Factory NPI teams, and all partners to drive solutions from NPI through End of Life (EOL)
• Collaborate with factory NPI team and TD key players to track and resolve all technical issues during NPI transfer

3. Customer Interface and Relationship Management

• Serve as the main interface to customers (e.g. CCG, DCG) and customer-facing teams (e.g. PBG), acting as the Voice of the Customer to APTM NPI operations
• Develop in-depth understanding of customer needs across various business units (CCG, DCG, NEX, PSG, FS) leveraging Foundry Services Expertise and OSAT benchmark knowledge
• Represent APTM NPI in customer Quarterly Business Reviews (QBRs) or Quarterly Technical Review (QTRs), site visits, audits, and aligned customer operational metrics reviews
• Lead NRE (Non-Recurring Engineering) and SOW (Statement of Work) engagements on behalf of APTM NPI

4. Technical Support and Problem Resolution

• Provide comprehensive technical support to resolve NPI and High Volume Manufacturing (HVM) issues
• Track and close all technical opens in collaboration with cross-functional teams
• Partner with TD to drive technology readiness and represent HVM-friendly voice in technology affordability initiatives

Required Experience

• Proven experience in NPI management and product transfer processes
• Strong background in semiconductor manufacturing, and backend operations e.g. assembly, and test operations
• Demonstrated ability to manage complex, multi-stakeholder projects
• Excellent communication and presentation skills for customer-facing responsibilities
• Experience with foundry operations and customer relationship management

Preferred Experience

• Experience with various customer segments
• Proven record in managing NPI department and Transfer Programs

Key Competencies

• Strategic thinking and problem-solving abilities
• Strong leadership and team management skills
• Customer relationship management
• Cross-functional collaboration
• Technical expertise in manufacturing processes
• Ability to work effectively in ambiguous and fast-paced environments

• Bachelor's degree in Engineering, Manufacturing, or related technical field
• 10 years of experience in NPI management and product transfer processes

Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

• Develop and validate detailed finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, thermal cycling, and reliability risks across a wide range of package architectures.

• Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on materials and properties to understand material behavior and reliability failure mechanisms.

• Support technology roadmap development by evaluating new materials, interconnect structures, and process flows from a thermo-mechanical reliability perspective.

• Drive design-of-experiment studies and sensitivity analyses to understand key drivers of package performance and reliability

• Contribute to the development and automation of internal simulation workflows, tools, and best practices to improve modeling efficiency and accuracy

• Develop solutions to problems utilizing formal education, experience and engineering judgment

• Communicate recommendation and solution space to internal and external customers. Responds to customer/client requests or events as they occur.

• Document and present simulation methodologies, results, and recommendations to both technical and executive audiences

• Stay current with industry trends, emerging technologies, and academic research in advanced packaging and simulation methodologies

• Strong communication skills across internal and external stakeholders andplanning/prioritizationskills for project success

• Ability to handle ambiguity and use appropriate skills (behavioral and/or technical) to drive clarity across stakeholders

• Willingness to lead and influence both external and internal teams

• Willingness to work independently with minimal supervision

• Technical problem-solving skills in a highly dynamic team environment

This role requires regular onsite presence to fulfill essential job responsibilities. Provides tactical and strategic operational support to ensure the successful development and ramp of a high volume or technology development fabrication facility.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.Minimum Qualifications:

• Master's Degree in Mechanical Engineering, Chemical Engineering, Material Sciences or a related field and 7+ years of industry experience

• -OR- PhD Degree in Mechanical Engineering, Chemical Engineering, Material Sciences or a related field and 4+ years of industry experience

Industry experience should include the following:

• Thermo-mechanical FEA modeling in semiconductor packaging domain

• At least one of the commercial FEA tools such as ANSYS, ABAQUS and COMSOL

• Advanced packaging technologies such as Foveros, EmIB, Cowos and Hybrid bonding.

• Semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow.

Preferred Qualifications:

• Experience with multi-physics simulations, including coupledelectro-thermal-mechanicalanalysis, free surface two phase flows, electroplating and plasma

• Familiarity with JEDEC reliability standards and qualification tests

• Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows

• Experience in technical program management in any assembly or test functional area

• Experience in driving yield improvement activities for advanced package architectures

• Previous related work experience in asemiconductor foundry preferred

Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Key Responsibilities

Develops abstract scope business & marketing plans, assesses market penetration and product positioning to drive competitive advantage, revenue and market share

Recommends investment decisions for new product development

Partners with Engineering, Manufacturing and Sales to develop new products and enhance existing products as well as communicate critical market needs and time requirements

Supports the Field to ensure synergistic account approaches and optimization of all opportunities for account partnership and penetration

Manages release of abstract products through the end of their product life cycle

Functional Knowledge

• Regarded as the technical expert in their particular field

• Demonstrates in-depth and/or breadth of expertise in own discipline and broad knowledge of other disciplines within the function

Business Expertise

• Anticipates business and regulatory issues; recommends product, process or service improvements

Leadership

• Leads projects with notable risk and complexity; develops the strategy for project execution

Problem Solving

• Solves unique and complex problems with broad impact on the business; requires conceptual and innovative thinking to develop solutions

Impact

• Impacts the direction and resource allocation for program, project or services; works within general functional policies and industry guidelines

Interpersonal Skills

• Communicates complex ideas, anticipates potential objections and persuades others, often at senior levels, to adopt a different point of view

Required Qualifications

• Ph.D. in Electrical/Chemical Engineering, Materials Science, Physics, or related field.
• Minimum 5 years of experience in semiconductor industry, preferably in advanced packaging or heterogeneous integration.
• Strong technical understanding of wafer-level processes, interconnect technologies, and integration flows.
• Excellent communication and presentation skills for technical and executive audiences.
• Proven project management experience and ability to lead cross-functional initiatives.
• Strong business acumen with ability to link technical capabilities to market value.

Preferred Qualifications

• Experience in leading-edge semiconductor manufacturing or ecosystem companies (e.g., major IDMs, foundries, or equipment suppliers).
• Familiarity with hybrid bonding, TSV, RDL, and advanced packaging architectures.
• Ability to perform competitive benchmarking and articulate differentiation.
• Experience turning technology strategy into market-driven business plans.

Job Description:

Job Description:
This job is responsible for operating insertion and printing equipment at a basic proficiency level for processing customer correspondence mailings. Key responsibilities include being production and quality focused in alignment with 5S Lean methodology and working in a high volume and demanding physical production environment. Job expectations include monitoring and executing on production plans by operating high speed manufacturing equipment.

• Operates insertion and printing equipment at a basic proficiency level while meeting production and quality standards under supervision
• Oversees machine set-up and inspects parts with precision prior to production initiating
• Stands for long periods and is able to push/pull/lift up to 50 pounds as required
• Executes routine quality inspections of printed and inserted material for accuracy and integrity
• Completes paperwork and day-to-day tasks in compliance with all policies, procedures, safety regulations, and 5S principles
• Communicates with department peers, supervisors, vendor representatives, and other departments to work effectively in a team environment
• Cross-trains on multiple pieces of equipment and in reconcilement functions as required

Skills:

• Attention to Detail
• Collaboration
• Active Listening
• Adaptability
• Decision Making
• Problem Solving
• Critical Thinking
• Innovative Thinking
• Written Communications

Role Overview:

The Senior Thermal Architect will lead thermal design and strategy for next-generation GPU, AI accelerators, and data center products. This role is critical to enabling high-performance computing at scale while meeting stringent thermal requirements. You will define thermal architecture across silicon, package, and platform levels, ensuring optimal thermal performance for products approaching multi-kilowatt levels:

Key Responsibilities:

• Define and deliver advanced packaging thermal solutions for advanced GPU/AI products
• Architect thermal strategies for 3DIC and advanced packaging technologies, including chiplets and heterogeneous integration.

• Develop analytical and experimental methods for thermal characterization and prediction.
• Drive co-optimization of thermal, electrical, and mechanical design across silicon, package, and system levels.

• Push the boundaries of thermal management to support Moore's Law progression.
• Evaluate and integrate emerging cooling technologies (e.g., liquid cooling, immersion cooling) for data center sustainability.

• Partner with silicon design, packaging, and platform teams to ensure thermal compliance and performance.
• Engage with external customers and ecosystem partners to align thermal solutions with product requirements.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Knowledge and/or experience listed below would be obtained through a combination of your school, work and/or classes and/or research and/or relevant previous job and/or internship experiences

Minimum Qualifications

• MS or PhD in Mechanical Engineering, Thermal Sciences, or related field.
• 10+ years in thermal design of semiconductor products
• Proven track record in thermal architecture and advanced packaging.
• Proficient in thermal simulation tools (e.g., CFD, FEA) and experimental validation.

Preferred Qualifications

• 10 + years experience in high-performance computing or data center products.
• Proven track record in GPU/AI thermal architecture and advanced packaging.
• Experience with rack-scale cooling solutions and liquid cooling technologies.
• Familiarity with AI/GPU performance trends and their thermal implications.
• Strong understanding of power delivery, energy efficiency, and cooling technologies.
• Ability to influence architecture decisions and drive innovation across global teams.

Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

This job is responsible for operating insertion and printing equipment at a basic proficiency level for processing customer correspondence mailings. Key responsibilities include being production and quality focused in alignment with 5S Lean methodology and working in a high volume and demanding physical production environment. Job expectations include monitoring and executing on production plans by operating high speed manufacturing equipment.

Line of Business Job Description:

A first level position requiring the operation of insertion and printing equipment for processing customer statements and other customer communications for a world class statement processor. The position requires an individual who is production and quality focused and who is capable of working in a high volume and demanding continuous production environment. Associates will be exposed to 5S and Lean Principles and will be expected to comply and exhibit behaviors consistent with 5S and Lean. The individual must be a self-starter, able to be cross-trained on multiple pieces of equipment (high speed and low speed), a team player, organized, and results oriented with exceptional work habits. Physical stamina, flexibility in work schedule, and decision-making ability are also required. Position requires compliance with all department policies and safety regulations. This position will work under the direct supervision of the shift leader(s).

This area is a high security work environment. Smocks and steel toed shoes are required to be worn at all times.

2nd Shift Monday through Friday 3:30pm to 12:00am

Responsibilities:

• Operates insertion and printing equipment at a basic proficiency level while meeting production and quality standards under supervision
• Oversees machine set-up and inspects parts with precision prior to production initiating
• Stands for long periods and is able to push/pull/lift up to 50 pounds as required
• Executes routine quality inspections of printed and inserted material for accuracy and integrity
• Completes paperwork and day-to-day tasks in compliance with all policies, procedures, safety regulations, and 5S principles
• Communicates with department peers, supervisors, vendor representatives, and other departments to work effectively in a team environment
• Cross-trains on multiple pieces of equipment and in reconcilement functions as required
• Lasering of all plastic types assuring appropriate file selection.
• Scanning receipt and updating of job controls into the Card Tracking System.
• Verifying and validating accuracy of lasered data on the plastic.
• Inserting and mailing of all plastic types assuring appropriate file selection.
• Verifying and validating accuracy of inserted mailers.
• Counting, Verifying and Documenting vault card inventory levels.
• Print all audit reports from InfoPrint.

Required Qualifications:

• Must be able to stand for long periods of times (up to 8 hours) and lift up to 50 pounds
• Previous machine work machine.
• Experience working in a production environment
• Able to constantly stand for 8 hours
• Able to push/pull/lift up to 50 lbs. as required throughout each shift
• Capability to work effectively in a team environment
• Orderliness in personal work habits
• Demonstrated mechanical aptitude
• Ability to write and complete basic data forms associated with production activity
• Ability to read, understand, and comply with English language production documents
• Ability to comply with basic English language verbal instructions
• Basic knowledge of numeric keyboard. Basic PC skills
• Demonstrated ability to learn quickly
• Demonstrated listening and understanding capabilities and the ability to be cross-trained
• Requires an ability to make sound decisions, solve problems, and to exhibit a continuous process improvement orientation
• Aptitude to interpret data and take action
• Ability to communicate effectively

Desired Qualifications:

• 1+ year of production related experience
• Previous experience operating insertion and/or print equipment

Skills:

• Attention to Detail
• Collaboration
• Active Listening
• Adaptability
• Decision Making
• Problem Solving
• Critical Thinking
• Innovative Thinking
• Written Communications

For internal employees; participation in a work from home posture does not make you ineligible to post, however, may require to meet the workplace excellence policy.