מציאת משרת הייטק בחברות הטובות ביותר מעולם לא הייתה קלה יותר
Job Area:
Engineering Group, Engineering Group > Hardware Engineering
General Summary:
The individual selected for the position, needs to be proactive, able to work in a fast-paced dynamic environment.
:
Evaluates, characterizes, and develops Test solutions for Qualcomm automotive module.
Interfaces with various cross-functional teams (e.g. Design, Software/System Engineering, Architecture Development, Packaging Team, Business Groups, Customer Engineering) to drive and incorporate the latest test solutions in the production program to improve the yield, test time, and quality.
Experience in project planning, giving direction to team
Experience in analyzing specifications, creating test plans and test execution is required.
Experience in developing test cases for Android/QNX-based devices is required.
Hands-on debugging/triaging experience on Module level issues using Android debugging tools and/or using JTAG Lauterbach/Trace32 is required.
Work with team to develop automatic reports, dashboards, and charts to share progress growth with key stack holders.
Required Logical reasoning and analytical skills to debug failures. Use technical expertise to identify solutions to test failures.
The candidate is expected to be self-driven to quickly get up to speed on various aspects of test developments & flexible to take up tasks as per the project needs.
Experience working with Perforce, GIT, or other Source Control SW is required.
Experience in production testing (Gauge R&R, shop floor) and handling OSATS is required
Experience on module testing, PCB debugs, SMT issues is required
Should be comfortable with reading Schematics and layout files of HW systems.
Good working knowledge of Android Architecture, Android Boot process, Kernel, Core BSP and Android Performance will be plus.
FA knowledge for driving module debugs is required.
Good system level understanding of the HW platforms having various peripherals like DDR, UFS, USB, Display, Camera, Power management IC is preferred.
Understanding of Module assembly, Boundary scan test and assembly defects will be plus.
Experience in Python, C#, .NET Framework, C/C++, Perl is a plus.
Working knowledge of system level benchmarks (e.g. like Dhrystone, AnTuTu, Monkey Test) will be a plus.
Preferred qualification:
Minimum 8+ years of experience
Able to lead a team of 5+ Experience in Module/System in Package/Board product testing at NPI or HVM. Experience with automotive product is a plus.
Rich Hands-on System/SW/bench test/ HW-SW interaction test experience, preferably in the Automotive/mobile devices/microprocessor industry.
Highly motivated, fast learner, team player with good communication skills.
Education: Master’s degree in Electrical Engineering, Electronics and Communication and Computer Science engineering.
Good in Korean will be a plus.
Minimum Qualifications
Minimum 8+ years of experience
Experience in Module/System in Package/Board product testing at NPI or HVM.
Education: Bachelor’s degree in Electrical Engineering or Electronics and communication or Computer Science engineering or Information systems.
Minimum Qualifications:
• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
: If you need an accommodation, during the application/hiring process, you may request an accommodation by sending email to accommodationsupport
Although this role has some expected minor physical activity, this should not deter otherwise qualified applicants from applying. If you are an individual with a physical or mental disability and need an accommodation during the application/hiring process, please call Qualcomm’s toll-free number found here (https://qualcomm.service-now.com/hrpublic?id=hr_public_article_view&sysparm_article=KB0039028) for assistance. Qualcomm will provide reasonable accommodations, upon request, to support individuals with disabilities as part of our ongoing efforts to create an accessible workplace.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
If you would like more information about this role, please contact Qualcomm Careers (http://www.qualcomm.com/contact/corporate) .
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification
משרות נוספות שיכולות לעניין אותך