דרושים Senior Package Layout Engineer ב-אנבידיה ב-Taiwan, Hsinchu

What you'll be doing:

• Mixed-Signal/Analog circuit design for High-Speed Memory I/O Interfaces

• Develop and implement high speed interfaces and analog circuits using the latest CMOS FinFET processes

• Help define circuit requirements and complete design from schematic, layout, and verification to characterization

• Optimize design to meet the specifications for system performance.

What we need to see:

• MS in Electrical Engineering, PhD is preferred.

• TX/RX related design experience or is fairly familiar with high-speed SerDes/analog circuit design concepts

• CMOS Analog / Mixed Signal Circuit Design Experience in deep sub-micron process (especially in FINFET)

• Strong background of Cadence custom design tools, various circuit simulators like Hspice, XA, FineSim, Spectre

• Experience in crafting test bench environments for component and top level circuit verification

• Knowledge of Verilog, Verilog-A, Matlab, or similar tools for behavioral modeling of analog and digital circuits is a plus

• Strong debugging and analytical skills

• Strong interpersonal skills and ability & desire to work as a good teammate

In this position, you will get the opportunity to face the challenge in building the complex GPU and Tegra chips and have chances to use cutting edge technology to solve those challenges. You will also have chances to interact directly with unit-level ASIC, Physical Design, CAD, Package Design, Software, DFT and other teams.

What you'll be doing:

• Define and develop system-level methodologies and tools to build SOCs in an efficient and scalable manner

• Identify inefficiencies and improvement opportunities in the front-end chip implementation process and propose ideas to tackle them

• Using AI to solve SOC Design related challenges

• Padring related methodology development

What we need to see:

• MS in Computer or Electrical Engineering or equivalent experience

• 3+ years of proven experience in chip design, specializing in SOC integration and methodology

• Excellent analytical and problem-solving skills

• Experienced in HW design, including: RTL design (Verilog), System-On-Chip design/integration flow, and design automation

• Has dependency management experience in a project, has AI development experience, has database concept

• Experienced script skills: Perl, Python, or other industry-standard scripting languages.

• Great communication and teamwork skills to interact within the team and across functional teams to build consensus

What you will be doing:

• Support inventory control team for Chip, Boards and Data Center business, which including the areas of inventory transactions, reconciliation, aging inventory management, lot size optimizations, shipment arrangement with subcons, system user acceptance testing, and all IC tasks assigned.

• Secure components required for production through material planning (include Assy raw material and substrate raw material). To assist generating purchase requisitions and purchase orders

• Maintain quotation in SAP system (OSAT).; To generate the blanket PO to support the subcons business and operation. To execute the scrap audit in subcons. To execute the factory physical audit.

• Understand the critical role of the new product introduction planning team in executing the time-to-market plan of all the new products.

• Collaborate with team members and business partners from different geographical locations. To apply your creativity and give feedback to the team members on ways to improve the business flows and work efficiency.

What we need to see:

• Degree in Industrial Engineering, Industrial Engineering Management or Business Administration.

• Good communication, problem-solving, teamwork, interpersonal, and quantitative skills.

• Proficiency in business software applications such as Microsoft Office (Excel, PowerPoint, Outlook).

• Language: Fluent English skills on reading, writing, speaking, and listening.

• Personality: highly organized, detailed orientated, a self-starter with a strong sense of ownership.

Ways to stand out from the crowd:

• Demonstrating consistently the desire and ability to absorb knowledge on real world operational problems that hinder NVIDIA's ability to hit production goals.

• Working with internal and external team members with strong interpersonal skills to establish action plans that can improve the overall performance of the company.

What You'll be Doing:

• Work on architecture and design of our state-of-the-art high speed coherent interconnects (NVLINK-C2C) for our mobile SoCs and GPUs.

• Collaborate with architects, external partners, software engineers, and circuit designers to deliver a class leading high speed coherent interconnect.

• Optimize design based on features, requirements, and system limitations”

What We Need to See:

• BS or equivalent experience in Electrical Engineering or Computer Engineer or related degree required.

• 5+ years or relevant design experience and knowledge in architecture, RTL design, performance analysis and power optimization.

• Knowledge of industry standard interconnect protocols like PCIE, CXL, AXI, CHI will be useful.

• Strong working knowledge of Verilog or System Verilog.

• Good communication skills and interpersonal skills are required.

Ways to stand out from the crowd:

• Master or PhD degree will be a preferred.

• A history of mentoring junior engineers and interns a huge plus.

What you'll be doing:

• Leading the development of groundbreaking microelectronics packaging for NVIDIA Networking Business Unit's future products

• Collaborating with world-leading vendors to develop highly ambitious packaging solutions

• Thriving in a dynamic and challenging environment

• Joining and leading task forces to investigate and support production excursions, failure analysis, and reliability issues

What we need to see:

• BSc or equivalent experience in Mechanical Engineering / Materials Engineering / Physics or similar

• 10+ years of experience ,at least 5 years of experience with complex ASIC package development and manufacturing

• Experience co-working with subcontractors and vendors

• Vision and focus for projects and team

• Curious and creative problem solver as well as organized and multi-tasker

• Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written)

• High awareness of quality, manufacturability and project schedule

Ways to stand out of the crowd:

• Hands-on FEA mechanical simulation experience

• Team / Group / Project management - advantage

• Experience with manufacturing environment and manufacturing statistics tools (for example – JMP)

• Background in semiconductor manufacturing processes

What you will be doing:

• You will act as a link between our master scheduling team and our key chip subcontractors to ensure the daily and weekly production schedule get executed as planned.
• Often times there will be issues related to the specs, business process, and data variance that need to be clarified. You will be planning's person in charge to communicate between different internal departments and our external partners to clarify such issues.
• You will work with other silicon operations teams to continue fine tuning the production best practices to improve the subcontractors’ performance. Examples include 1) setting optimal lot size, 2) production loading cadence, 3) ideal product mix, 4) rules for prioritization, etc.
• You will monitor the subcontractors’ performance continuously to ensure all KPI targets are met. You will analyze the weekly performance data and prepare an executive summary.
• You will work with the program managers & engineers on how to best let the factories successfully carry out complex engineering experiments and fulfill engineering unit demand.
• It's Nvidia's culture to keep striving for continuous improvement with our partners. You will provide suggestions to the management team of Nvidia and its subcontractors on how to pursue a higher performance level on our Key Performance Index: committed shipment hit rate, cycle time, and production line efficiency.

What we need to see from you:

• Degree in Industrial Engineering, Industrial Engineering Management or Business Administration.
• Good communication, problem-solving, teamwork, interpersonal, and quantitative skills.
• Proficiency in business software applications such as Microsoft Office (Excel, PowerPoint, Outlook).
• Language: Fluent English skills on reading, writing, speaking, and listening
• Personality: highly organized, detailed orientated, a self-starter with a strong sense of ownership.

Ways for you to stand out from the crowd:

• Demonstrating consistently the desire and ability to absorb knowledge on real world operational problems that hinder NVIDIA's ability to hit production goals.
• Able to work with internal and external team members using strong interpersonal skills.
• To establish action plans that can improve the overall performance of the company.

The candidate will be responsible for the development and implementation of structural test plan since EVT build to find SMT, PCB, and component issues earlier to catch and fix rather than finding them later at following stations which will complicate and delay the debug time. You will work closely with PCB designers, tester vendors, fixture houses and CMs to enable the process.

What you will be doing:

• Define ICT capability, HW design requirements, and board debug capabilities from design review phase, NPI bring-up to mass production phase.

• Optimize the structural test plan to find SMT, PCB, and component issues earlier.

• Develop Data Science – machine learning of structural tests thru data feed forward and backward.

• Work with board designers, layout engineers, tester vendors, and fixture houses by providing detailed DFM and guidance to meet ICT requirements.

• Provide support for production bring-up and debugging.

• Support new tester platform bring-up and diag validation in Taiwan. (ICT, BSI, FCT universal tester, etc.).

• Coordinate test fixtures/platform automation with suppliers, CMs, and global team.

• Define and provide procedure/document and technical support if needed.

What you need to see:

• Master degree (or equivalent experience) in Electrical, Mechanical, Materials, or other related fields.

• Experience in ICT development capability, HW design understanding, board debug capabilities. and structural test understanding.

• Experience in FCT HW setup, maintenance, and troubleshooting.

• Good knowledge of board manufacturing flow, PCB/fixture design, proven program management capability, experience and results.

• Excellent communication, quantitative, problem-solving, and decision-making skills.

• Must be a strong team player, supporting & analytical skill, and good working habits.

• Self-starter who can accomplish assigned tasks with minimal supervision.