Expoint – all jobs in one place
מציאת משרת הייטק בחברות הטובות ביותר מעולם לא הייתה קלה יותר

דרושים Corporate Counsel Data Privacy & Protection ב-Marvell ב-קנדה

מצאו את ההתאמה המושלמת עבורכם עם אקספוינט! חפשו הזדמנויות עבודה בתור Corporate Counsel Data Privacy & Protection ב-Canada והצטרפו לרשת החברות המובילות בתעשיית ההייטק, כמו Marvell. הירשמו עכשיו ומצאו את עבודת החלומות שלך עם אקספוינט!
חברה (1)
אופי המשרה
קטגוריות תפקיד
שם תפקיד (1)
Canada
עיר
נמצאו 2 משרות
07.05.2025
M

Marvell Corporate PMO Project Analyst Canada

Limitless High-tech career opportunities - Expoint
Define package guidelines and drive implementation in product design, focusing on FC bumping, RDL and wafer level package. Manage and drive OSAT on package technical risk assessment, design review, BOM...
תיאור:

What You Can Expect

  • Define package guidelines and drive implementation in product design, focusing on FC bumping, RDL and wafer level package.

  • Manage and drive OSAT on package technical risk assessment, design review, BOM and process selection, package characterization and qualification.

  • Fully in charge of NPI package related tasks, starting from package definition, first sample delivery, package qualification and production ramp.

  • Work closely with internal cross functional teams and lead package development of NPI from concept to production.

  • Work with QA, OSAT/substrate suppliers to resolve package related quality/reliability issues.

  • Work with procurement and suppliers on package cost analysis.

What We're Looking For

  • Experiences in semiconductor wafer level packaging is a must. Education: BS, MS or PhD in ME, MSE, EE or related engineering fields.

    • BS with 5-10 years of experience

    • Prefer MS/PhD with 3+ years of experience

  • Have passion for work; self-motivated, eager to learn and grow; be responsible and accountable; and result driven.

  • The ideal candidate has good knowledge of design rule, process, and materials used in FC bumping and wafer level packaging.

  • Good understanding of semiconductor IC packaging assembly processes, materials, reliability standards and failure analysistechniques.

  • Experiences in Si photonics packaging is a plus.

  • Basic KLayout, Cadence APD and AutoCAD skills

  • Good communication skill is essential to work well with internal cross functional teams and external suppliers.

  • Good program management skills.

  • Ability to work independently with minimum supervision.

Expected Base Pay Range (USD)

115,790 - 173,500, $ per annum

The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions.The expected base pay range for this role may be modified based on market conditions.


Additional Compensation and Benefit Elements

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at

Show more
06.04.2025
M

Marvell Corporate Counsel Data Privacy & Protection Canada

Limitless High-tech career opportunities - Expoint
Act as a strategic advisor and thought partner to the SVP, providing insights, recommendations, and decision support. Manage the organizational priorities, ensuring alignment with organizational goals and initiatives. Facilitate and...
תיאור:

What You Can Expect

Strategic Responsibilities:

  • Act as a strategic advisor and thought partner to the SVP, providing insights, recommendations, and decision support.
  • Manage the organizational priorities, ensuring alignment with organizational goals and initiatives.
  • Facilitate and prepare for executive meetings, including agendas, presentations, and follow-ups. Be prepared to present to the executive team on behalf of SVP as needed.
  • Act as a liaison between the SVP and internal/external stakeholders, fostering effective communication and collaboration.
  • Drive organizational alignment by ensuring clear communication of the SVP’s vision and directives across teams.

Engineering Program Management:

  • Oversee the silicon engineering program management, ensuring the successful execution of programs.
  • Establish robust processes, tools, and metrics to track project progress, risks, and deliverables.
  • Partner with other engineering, business operations teams to drive complex, cross-functional programs to completion on time and within budget.

Customer and Stakeholder Engagement:

  • Build and maintain strong relationships with key customers and partners.
  • Collaborate with business development and sales teams to understand and address customer needs.
  • Represent the organization at customer meetings, internal cross BU, and executive meetings.

Technology and Industry Expertise:

  • Stay informed about the latest technologies and trends in the semiconductor and hardware sectors.
  • Identify opportunities to leverage new technologies to drive innovation and business growth.
  • Provide thought leadership and insights on market dynamics, competitive landscape, and technology advancements.

What We're Looking For

  • Minimum of 12 years of experience in the semiconductor industry, with a proven track record of success in leadership, program management, and customer-facing roles.
  • Bachelor’s degree in engineering in Electrical or Computer Science; an advanced degree (MBA or MS) is highly desirable.
  • Exceptional verbal and written communication skills, with the ability to influence and engage at all levels of the organization.
  • Strong program and project management expertise, with proficiency in project planning, risk management, and issue resolution.
  • Proven ability to work effectively with executive leadership, cross-functional teams, and external stakeholders.
  • Strong technical background with successful engineering roles in prior experience is highly desirable.
  • Deep understanding of semiconductor industry technologies, trends, and business dynamics.
  • Strategic thinking and problem-solving skills with a results-oriented mindset.
  • Demonstrated ability to drive organizational transformation and process improvement.
  • Experience managing global teams and cross-cultural collaborations.

Expected Base Pay Range (USD)

197,140 - 295,300, $ per annum

The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions.The expected base pay range for this role may be modified based on market conditions.


Additional Compensation and Benefit Elements

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at

Show more

משרות נוספות שיכולות לעניין אותך

Limitless High-tech career opportunities - Expoint
Define package guidelines and drive implementation in product design, focusing on FC bumping, RDL and wafer level package. Manage and drive OSAT on package technical risk assessment, design review, BOM...
תיאור:

What You Can Expect

  • Define package guidelines and drive implementation in product design, focusing on FC bumping, RDL and wafer level package.

  • Manage and drive OSAT on package technical risk assessment, design review, BOM and process selection, package characterization and qualification.

  • Fully in charge of NPI package related tasks, starting from package definition, first sample delivery, package qualification and production ramp.

  • Work closely with internal cross functional teams and lead package development of NPI from concept to production.

  • Work with QA, OSAT/substrate suppliers to resolve package related quality/reliability issues.

  • Work with procurement and suppliers on package cost analysis.

What We're Looking For

  • Experiences in semiconductor wafer level packaging is a must. Education: BS, MS or PhD in ME, MSE, EE or related engineering fields.

    • BS with 5-10 years of experience

    • Prefer MS/PhD with 3+ years of experience

  • Have passion for work; self-motivated, eager to learn and grow; be responsible and accountable; and result driven.

  • The ideal candidate has good knowledge of design rule, process, and materials used in FC bumping and wafer level packaging.

  • Good understanding of semiconductor IC packaging assembly processes, materials, reliability standards and failure analysistechniques.

  • Experiences in Si photonics packaging is a plus.

  • Basic KLayout, Cadence APD and AutoCAD skills

  • Good communication skill is essential to work well with internal cross functional teams and external suppliers.

  • Good program management skills.

  • Ability to work independently with minimum supervision.

Expected Base Pay Range (USD)

115,790 - 173,500, $ per annum

The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions.The expected base pay range for this role may be modified based on market conditions.


Additional Compensation and Benefit Elements

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at

Show more
בואו למצוא את עבודת החלומות שלכם בהייטק עם אקספוינט. באמצעות הפלטפורמה שלנו תוכל לחפש בקלות הזדמנויות Corporate Counsel Data Privacy & Protection בחברת Marvell ב-Canada. בין אם אתם מחפשים אתגר חדש ובין אם אתם רוצים לעבוד עם ארגון ספציפי בתפקיד מסוים, Expoint מקלה על מציאת התאמת העבודה המושלמת עבורכם. התחברו לחברות מובילות באזור שלכם עוד היום וקדמו את קריירת ההייטק שלכם! הירשמו היום ועשו את הצעד הבא במסע הקריירה שלכם בעזרת אקספוינט.