דרושים מנהל פיתוח תוכנה ב-אינטל ב-מלזיה

Job Description:

• Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
• Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
• Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
• Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
• Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.
• Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.
• Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.
• Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.
• Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.
• Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur.
• Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.

Qualifications:

Minimum Qualifications:

• Possess a Bachelor's or Master's degree in Mechanical Engineering/MaterialEngineering/ElectricalEngineering/Physics related field.
• Minimum 2 year+ of experience in fundamental science and engineering concepts in development to create novel solutions, including strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Experience in analytics and design tools in packaging industry like - AutoCAD, Solidworks, etc)
• Experience working with Engineering drawing and tolerancing analysis, design rules.

Preferred Qualifications:

• Strong mechanical design software experience (SolidWorks, AutoCAD, etc)
• Portfolio of self-completed concept to fabrication project examples Assembly equipment, process, media, and/or collateral experience.
• Technical innovation and deliver results for complex, time critical technical projects.
• Understanding of semiconductor fabrication processes and technology with technical and analytical skills.

Experienced HireShift 1 (Malaysia)Malaysia, Kulim

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

• Collaborate with technical, platform and business unit/product stakeholder groups to ensure supply chain is enabled and ready to deliver on time per test vehicle (TV) and/or product schedules.• Partner with internal technology segment Program Managers and others in the Substrate Business Group (SBG) to maintain the substrate sourcing strategy and manage TV and product line items within in.• Collect, vet, and distribute TV and new product introduction (NPI) quotes for new substrate designs. Maintain the quote database and SAP system setup with pricing.• Partner with TD team to balance (ROI) the cost/requirements imposed on suppliers by module requests. Highlight / escalate cost impacts.• Manage substrate engineering demand forecasts and distribute them to suppliers. Interpret supplier-report responses into actionable supply chain decisions to maximize Intel's ability to fulfill substrate demands.• Track substrate high volume manufacturing (HVM) readiness for products owned.• Facilitate supplier PO and invoice/payment resolutions when needed (working with Finance and Supplier Managers).• Manage and regularly report out SBG indicators regarding test vehicle or product substrate supply chain health.• Develops and executes commodity strategies, as well as drives supplier development through innovation and collaboration.• Maintains advanced knowledge of industry and market dynamics, and knowledge of commodities to drive supply chain solutions ahead of Intel's needs.• Owns relationships and coordinates purchasing activities with cross functional teams to acquire materials and services in a cost effective and timely manner.• Ensures that the respective commodity meets the business demand and cost requirements necessary for Intel to develop great products/services for its customers • Works with partner teams to capture commodity requirements and understand how design can influence cost and give feedback.• Leads sustainability and regulatory compliance and ensures suppliers comply with Intel's business processes
Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
Bachelor's degree in Supply Chain Management, Business, technical or related field, or expect the required degree with 5+ years relevant experience
- or -
Master's degree in the same fields with 3+ years of relevant experienceRelevant work experience should be of the following:
• Project management skills or certification.
• Experienced in managing the overall strategy of the supplier account from initial selection, through product development, into high volume manufacturing HVM, and long-term sustaining support.
• Experienced in SAP enterprise or similar systems for order management and procurement.
• Skilled in planning and closing contract negotiations to achieve immediate and long-term affordability requirements.Preferred Qualifications:
• Experience with Semiconductor substrate manufacturing, supplier capability analysis and capacity expansion requirements
• Direct Supply Chain experience and, or technical degrees and experience are a plus.
• Lean Six Sigma is highly desired.

Experienced HireShift 1 (Malaysia)Malaysia, Penang

Job Description:

Manage and drive the Atom CPU post-si validation activities to align and meet goal and schedule of products.
The work encompasses:

• Define and manage validation plan and schedule with a thorough understanding of dependency management, key milestones, including critical path analysis.
• Aid in development, definition, and execution of POR that include schedules, budgets, resources, deliverables, and risks/mitigation.
• Provide assessment of Atom CPU health and manage key indicators.
• Represent Atom team to key project and validation forums.
• Facilitate meetings and reviews with stakeholders to drive validation readiness, execution, issue closures and risk mitigation.

Qualifications:

• Possess a BS/BE degree or higher with proven technical experience in engineering program management and understanding of silicon design.
• Possess have strong communication, collaboration and influencing skill.
• Certifications such as Project Management Professional (PMP) and experience in post-si validation will be an added advantage.

Experienced HireShift 1 (Malaysia)Malaysia, Penang

Job Description:

Note: This role requires regular onsite presence to fulfill essential job responsibilities.

• Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
• Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
• Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
• Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
• Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.
• Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.
• Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.
• Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.
• Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.
• Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur.
• Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.

Qualifications:

• Prefer an individual who possess a MSc/PhD degree in Mechanical Engineering/MaterialEngineering/ElectricalEngineering/Chemical Engineering/Physics with focus onthermal/fluid/packagingassembly process engineering or related engineering background, with at least 3 years of working experience. Bachelor’s Degree with strong relevant experience can also be considered.
• Fundamental understanding of semiconductor assembly equipment and processes.
• Developing new processes through hardware /toolset development is a plus.

Experienced HireShift 1 (Malaysia)Malaysia, Kulim

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

Job Description:

• Designs, develops, tests, and debugs software applications used by end users or integrated with other applications by ISVs.

• Development may span the full application stack including both frontend and backend application development.

• Uses modern software development methodologies and programming languages, follows secure coding practices and software legal compliance guidelines,

• analyzes user stories, writes both functional and test code, automates build and deployment, and performs unit integration and end to end testing of applications.

• Completes SDL tasks with the assistance of product security engineers and provides input to technical writers to complete product documentation and procedures for installation and maintenance.

• May also interact with end users to define system requirements and/or necessary modifications.

Qualifications:

Minimum Qualifications:

• BS, MS, or PhD in Computer Science, Computer Systems Engineering, or Engineering related discipline.

• 1+ years of experience working with semiconductor factory automation factory systems such as Manufacturing Execution System (MES), Manufacturing Kitting Control Systems, Process Control Systems (PCS), NPI Systems, equipment automation, and/or engineering analysis tools.

Preferred Qualifications:

• Experience in factory Automation application development including process equipment, control systems, and data analytics.

• Experience translating technology roadmaps to capability deliverables.

• Experience working with Cloud technologies and containers

• Experience working on Kafka and KSQL

College GradShift 1 (Malaysia)Malaysia, Penang

Job Description:

Responsibilities for this position include the following: performing evaluation and debugging of new test programs, resolving product manufacturability issues related to product testing hardware and software, performing data analysis, and deploying solutions to improve test coverage, yield, capacity, and product health indicators.

The job also involves developing and debugging support software for test program validation, data analysis, and debugging

Qualifications:

• The successful candidate will be a Bachelor's or Master's graduate in Electrical Engineering, Electronic Engineering, Telecommunication, Automation and Control Engineering, Computer Engineering, or Computer Science.
• Excellent problem-solving, technical, team, and communication skills.
• Python and object-oriented programming skills would be an advantage for this position.Excellent problem solving, technical, team and communication skills.

Experienced HireShift 1 (Malaysia)Malaysia, Penang

- Responsible for ensuring the testability and manufacturability of integrated circuits from the component feasibility stage through production ramp. Test, validateExperienced HireShift 1 (Malaysia)Malaysia, PenangThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.