דרושים Manager Process Engineering Advanced Packaging ב-Applied Materials ב-Singapore, Singapore

Key Responsibilities

• Develops, aligns and implements commodity strategies.
• Negotiates and manages the maintenance of agreements with suppliers that provide the structure for all business relationships between Applied Materials and the supply base.
• Engages with the PLC process to ensure alignment with the commodity strategies.
• Directs new supplier introduction and/or disengagement requirements to/from the Applied Materials supply base.
• Drives resolution to systemic supply chain issues affecting quality, cost, delivery or lead-time, which may include engagement with sub-tiers in the supply chain.
• Develops and presents high level cost reduction opportunities.

Functional Knowledge

• Demonstrates depth and/or breadth of expertise in own specialized discipline or field.

Business Expertise

• Interprets internal/external business challenges and recommends best practices to improve products, processes or services.

Leadership

• May lead functional teams or projects with moderate resource requirements, risk, and/or complexity.

Problem Solving

• Leads others to solve complex problems; uses sophisticated analytical thought to exercise judgment and identify innovative solutions.

Impact

• Impacts the achievement of customer, operational, project or service objectives; work is guided by functional policies.

Interpersonal Skills

• Communicates difficult concepts and negotiates with others to adopt a different point of view.

Key Responsibilities

Enable Next-Gen Solutions Through Direct Engagement:

• Act as the technical owner for PVD solutions at assigned OSATs and Fabless accounts, ensuring alignment between design requirements and manufacturing processes.

• Understand Customers and Fabless stakes holders technical roadmap.

• Partner with Fabless packaging architects to define material stacks, reliability criteria, and integration flows; translate these into executable solutions for OSATs.

• Lead joint qualification programs involving Fabless and OSAT stakeholders: define success metrics, DoEs, and acceptance gates; manage execution to schedule.

Process Qualification & Ramp:

• Establish process-of-record (POR) for advanced packaging applications (e.g., RDL barrier/seed, TSV liners, hybrid bonding underlayers).

• Drive tool acceptance (FAT/SAT) and HVM ramp at OSAT sites: SPC setup, chamber matching, defectivity control, and yield stabilization.

• Validate PVD film integrity under Fabless-driven reliability tests (JEDEC/IPC standards: EM, TDDB, thermal cycling).

Cross-Functional Collaboration:

• Coordinate with Applied Materials’ Product Engineering, Field Service, and Quality teams to deliver robust solutions tailored to OSAT and Fabless needs.

• Resolve integration challenges across packaging flows (e.g., ESD, adhesion, contamination, stress) through structured problem-solving.

Continuous Improvement:

• Lead structured root cause analysis on yield/reliability excursions; implement corrective actions and verify effectiveness.

• Provide feedback to internal engineering for hardware and process enhancements based on OSAT and Fabless requirements.

Required Qualifications

• Bachelor’s or Master’s in Materials Science, Physics, Chemical Engineering, or related field; PhD preferred.

• 10+ years in semiconductor equipment/process engineering with strong PVD experience in Advanced Packaging (FO-WLP, 2.5D/3D, RDL/UBM).

• Proven success enabling solutions through direct engagement with OSATs and Fabless design houses.

Preferred Qualifications

• Experience enabling hybrid bonding or chiplet integration through PVD underlayers.

• Familiarity with APAC OSAT ecosystem and Fabless packaging roadmaps.

• Proficiency in SPC, DOE, metrology, and yield analytics.

• Expertise in thin-film metallurgy (Cu, Ni, Ti, Ta/TaN, Co) and reliability-critical stack design.

• Strong communication skills to engage executive Fabless stakeholders and OSAT engineering teams.

Work Location

• Science Park II (Moving to Tampines in end 2026)

Advanced Packaging Process Development

• Define and implement process flows for panel-level packaging and other advanced panel technologies.

• Drive material selection and compatibility studies for large-format form factors.

• Keeps abreast of new developments in own and related technology groups. Participates in publishing in ET conferences and journals.

• Develop innovative solutions as part of proven track record of significant technology contributions. Recognized internally (across Business Units) as one of the limited number of technical experts in their field of expertise

• Conceive and implement new technology, normally named as primary inventor on numerous critical patents and recognized through awards and/or published papers within the last five years.

• Leads and collaborates to contribute to the development of new principles and concepts. Guides less experienced engineers in utilizing techniques to define methods and new technologies and apply them on unusually complex systems. Involved in judging the approach and verifying the validity of technical strategies.

Functional Knowledge

• Optimize thin film deposition techniques such as Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD) (Including PECVD for low-temperature applications), Atomic Layer Deposition (ALD) for atomic-scale control and high-k dielectrics.

• Electrochemical Deposition (ECD): For metal layers in advanced packaging.

Cross-Functional Collaboration

• Works with business unit in technology development and transfer to customers including customized process development. Plans unit process sequence based on customer requirements. Negotiates process specifications and service offerings with customers. Takes ownership of delivering the required solution to the customers that meets specification.

• Serves as the customer expert across a broad range of products. Plays a key role in defining product strategy and identifying gaps. Provides feedback to business unit heads on process and hardware improvements to meet customer roadmap requirements.

• Work closely with design, reliability, and materials teams to ensure manufacturability and performance.

• Support technology transfer from development to high-volume manufacturing.

• Provides oversight of customer demos, including defining demo conditions and analyzing results.

Data Analysis and Continuous Improvement

• Analyze process data for trend identification and optimization.

• Drive continuous improvement initiatives for unit level process and cycle time improvement.

• Conduct root cause analysis for defects and implement corrective actions to improve yield and reliability.

• Within safety guidelines design, perform, collect data, analyze and compile reports on unusually complex engineering experiments and provides solutions which are highly innovative and ingenious.

Requirements

• Bachelor’s degree with 15 years of experience, Master’s degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field.

• Expertise in thin film deposition techniques and dielectric etch and panel packaging process integration .

• Experience with advanced packaging technologies such as fan-out panel-level packaging (FOPLP), substrate technology and wafer Back-end technology.

• Knowledge of industry standards and best practices in semiconductor packaging.

• Strong understanding of semiconductor packaging technologies and process flows.

• Strong knowledge of process characterization and troubleshooting.

• Excellent problem-solving skills and ability to work in a fast-paced environment.

• Ability to work in a cleanroom environment

• Excellent communication skills

Work Location

• Science Park II (Moving to Tampines in end 2026)

Key Responsibilities

• Develops, aligns and implements commodity strategies.

• Negotiates and manages the maintenance of agreements with suppliers that provide the structure for all business relationships between Applied Materials and the supply base.

• Engages with the PLC process to ensure alignment with the commodity strategies.

• Directs new supplier introduction and/or disengagement requirements to/from the Applied Materials supply base.

• Drives resolution to systemic supply chain issues affecting quality, cost, delivery or lead-time, which may include engagement with sub-tiers in the supply chain.

• Develops and presents high level cost reduction opportunities.

Functional Knowledge

• Demonstrates depth and/or breadth of expertise in own specialized discipline or field.

Business Expertise

• Interprets internal/external business challenges and recommends best practices to improve products, processes or services.

Leadership

• May lead functional teams or projects with moderate resource requirements, risk, and/or complexity.

Problem Solving

• Leads others to solve complex problems; uses sophisticated analytical thought to exercise judgment and identify innovative solutions.

Impact

• Impacts the achievement of customer, operational, project or service objectives; work is guided by functional policies.

Interpersonal Skills

• Communicates difficult concepts and negotiates with others to adopt a different point of view.

Key Responsibilities

• Design, collect data, analyze and compile reports on a wide range of complex process engineering experiments for multiple products, within safety guidelines

• Utilize techniques to characterize hardware, define methods and apply new technologies to characterize hardware, and/or perform hardware characterization on a wide range of complex systems for multiple products, within safety guidelines

• Generate internal and external documentation for products, presentations, technical reports and generate process engineering specifications

• Develop, plan and execute process engineering projects, within safety guidelines

• Train engineers in measurement techniques of film properties and guide them in the interpretation of the data, new methodologies, trouble shooting techniques and resolve a wide range of complex process engineering issues/problems for multiple products

• Interact with customers to resolve a wide range of complex process engineering issues/problems with limited to no supervision

• Design and implement new technology, products and analytical instrumentation

• Identify, select and work with vendors and suppliers with limited to no supervision

Requirements:

• PhD or Master or Bachelor inMaterials Science, Chemical Engineering, Chemistry or Physics or related field

• Research focus in semiconductor would be an added advantage

• At least 5 years of relevant experiences in semiconductor including Plasma Etch process development field

• Outstanding communication and interpersonal skills

• Problem-solver attitude with determination and quality-mindset

Work Location:

• Science Park II

Key Responsibilities

• Develops new or modified process formulations, defines processing or handling equipment requirements and specifications, and reviews processing techniques and methods applied in the manufacture, fabrication, and evaluation of products. Involvement may begin at any step from pilot plant to full-scale manufacturing

• Coordinates design requirement review with appropriateengineering/scientificpersonnel to ensure compatibility of processing methods. Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications

• May conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes

• Partner with the customers and the Business Units for assigned projects, ensuring clear understanding of customer issues and delivery of applicable solutions.

• Provide technical support to manufacturing and product teams to resolve process-related challenges and optimize production efficiency.

• Collaborate with global teams, customers, and partners to accelerate the adoption of new technologies and processes.

• Maintain rigorous documentation of process development activities, experiments, and outcomes.

• Participate in cross-functional meetings to ensure alignment between engineering, marketing, and business objectives.

• Drive adoption of new technologies through demos, evaluations, joint development programs, and tool qualifications.

• Manage and develop a team of Process Engineers, ensuring training, certification, and performance excellence.

• Responsible for demand planning and financial forecasting for PE activities.

• Contribute to business plans and resource allocation to meet organizational priorities.

• Demonstrate advanced integration knowledge across multiple processes and technologies.

• Resolve complex technical and operational issues using structured problem-solving approaches.

Requirements

• PhD/ Master/ Bachelor in Engineering studies

• 7 years and above of process-related experiences in semiconductor industry with at least 3 years in leadership roles.

• Prior work experiences in a technical support or field service role will be an added advantage

• Strong technical background in semiconductor processes and equipment.

• Excellent communication and interpersonal skills for customer-facing interactions.

• Ability to manage multiple teams and projects simultaneously.

Work Location

• Science Park II (Moving to Tampines in end 2026)