

Key Responsibilities
Improve current generation plasma activation technology for hybrid bonding and develop next generation plasma technology and process
Design and execute experiments to study various types of plasma and their processes to understand their interaction with bonding surfaces. Analyze data to identify the key and common factor(s) of plasma that contributes to the strongest activation for hybrid bonding.
Optimize process and/ or drive CIPs to improve current generation plasma chamber. Identify the most suitable plasma technology and conduct CnF tests to define requirements for next generation chamber.
Deep dive with local & global engineering teams to prototype next gen chamber based on defined requirements. Evaluate proto chamber for hybrid bonding process, propose innovative solutions, and drive engineering optimization.
Plasma technology & process subject-matter expect to guide account/field teams on tough plasma technical issues in terms of process and physics.
Functional Knowledge
Good understanding of plasma physics and processes is essential.
Practical background on any types of plasma technology and its characterization is needed.
Familiar with common plasma characterization tools (such as OES, ion sensor, RGA, thickness measurement etc.) and methodology.
Knowhow to analyze surface characterization results (XPS, TEM, phase analysis, SIMS, EELS, etc) is a strong plus.
Any backgrounds of WoW or CoW bonding is a bonus.
Opportunities
On-job training on CoW hybrid bonding processes and challenges.
Developing a state-of-the-art integrated hybrid bonder and play a part in this historical industrial inflection from micro-bump/TCB to hybrid bonding. Working with subject-matter experts in various areas around the globe on plasma product development.
Technical training on/ exposure to up & downstream integration processes and interaction with hybrid bonding
Requirements
Engineering or science university educational background.
> 2 years experiences on plasma HW/ process development preferred.
10% travel commitment to the US (California), Taiwan, Korea or Europe
Working Location
Science Park II, Singapore
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Role Responsibilities:
Minimum Qualifications:
2–4 years of work experience in customer/field service support, or a related technical field
This position often requires extensive walking, standing for extended periods of time, working in tight spaces, bending, squatting, twisting, kneeling, reaching, climbing stairs and ladders, working at height, lifting up to 35 lbs., the ability to distinguish between colors and working with electricity, the ability to work in an environment with noise that may be difficult for some individuals with sensitivity to noise, and the use of hand and power tools. Additionally, because this position generally involves working in a clean room, it requires the use of appropriate Personal Protective Equipment such as coveralls, hoods, booties, safety glasses, gloves, respirators, chemical aprons, and face shields.

General Profile
Possesses in-depth knowledge and extensive experience in Environment, Health, and Safety (EHS). Applies best practices and leverages both internal and external insights to drive continuous improvement in EHS culture. Demonstrates strong problem-solving skills by approaching complex challenges with innovative thinking and proven solutions. Operates independently with minimal supervision and serves as a key resource and mentor for less experienced colleagues.
Key Responsibilities
Other Requirements:

Key Responsibilities
Functional Knowledge
Business Expertise
Leadership
Problem Solving
Impact
Interpersonal Skills

Key Responsibilities
Functional Knowledge
Business Expertise
Leadership
Problem Solving
Impact
Interpersonal Skills
Education:Bachelor's Degree
Experience:15+ Years
This position may require certified ISO14001, ISO18001 internal auditor. Certification of Work safety and health officer; Certification of Fire Safety Manager.
Full timeAssignee / Regular
What We Offer
Bangalore,IND, Singapore,SGPAs a Customer / Field Service Engineer Leader, you will play an integral role in supporting the first private semiconductor FAB in India and in building the semiconductor ecosystem within the country. This position offers the prospect of advancing your career alongside the industry while establishing a high-performing team from the ground up.
To learn more about life as a Field Service Engineer, visit the
Responsibilities
Building the Organization: Responsible for creating the Field Service Organization, which includes hiring, onboarding, and upskilling talent to meet business requirements.
Leadership: Provides direction, coaching, and development for team members.
Problem Solving: Identifies and resolves technical, operational, and organizational issues.
Customer Relationship Management: Maintains and develops relationships with customers.
Operational Management: Manages financial, manpower, and operational requirements.
Communication: Effectively communicates business progress, goals, and updates.
Safety Practices: Ensures appropriate safety practices among team members.
Quality Improvement: Promotes processes to reduce cycle time and drive continuous improvement.
AdditionalRequirement (JobLocation)
Domain Skills
Sound Industrial Engineering practices related to the Semiconductor Domain (e.g., preventive and corrective maintenance).
Comprehensive understanding of the semiconductor industry, wafer FAB equipment, and chip manufacturing processes.
In the absence of semiconductor domain experience, an equivalent background in biotechnology manufacturing or pharmaceutical manufacturing is preferred.
Experience- 15+ Years
Bachelors/Masters in Engineering or Equivalent. Preferably in Mechanical, Electrical, Mechatronics, Industrial, Chemical andMetallurgy.
Additional Certifications complementing the Semiconductor, Pharma or Biotechnology domain will be a value add.

About this role
Looking for a motivated and hands-onto support the setup and ramp of our next-generation semiconductor manufacturing line. In this role,operationsdrive smooth technology transferand ramp toin process transfer topilot production linewill be critical to a successful and efficientfab ramp-up.
Responsibilities:
and trainonexistingR&D processes andtransferknowledge to pilot production line
Create acomprehensivechecklistto ensuresuccessful transfer of processesand materials
Collaborate with R&Dandproductionprocess, integration,operationsand hardware teams to ensurecompleting the checklist on time to meet timeline needed to start HVMoperations
Track and manage schedules, deliverables, and risks for technology transfer and production milestones.
Coordinate trainingwith R&D transferengineers
Support tools and process qualifications at HVM site
Qualifications:
Strong understanding ofsemiconductormanufacturing processesand industry standardsincluding deposition, etch, lithography and metrology
Comfortable working across time zones, collaborating with remote teams, and supporting factory-side execution
Disciplinetracking and driving deliverables to completion
Flexibility to travel back and forth betweenSouth EastAsia and the USA
Work Location:

Key Responsibilities
Improve current generation plasma activation technology for hybrid bonding and develop next generation plasma technology and process
Design and execute experiments to study various types of plasma and their processes to understand their interaction with bonding surfaces. Analyze data to identify the key and common factor(s) of plasma that contributes to the strongest activation for hybrid bonding.
Optimize process and/ or drive CIPs to improve current generation plasma chamber. Identify the most suitable plasma technology and conduct CnF tests to define requirements for next generation chamber.
Deep dive with local & global engineering teams to prototype next gen chamber based on defined requirements. Evaluate proto chamber for hybrid bonding process, propose innovative solutions, and drive engineering optimization.
Plasma technology & process subject-matter expect to guide account/field teams on tough plasma technical issues in terms of process and physics.
Functional Knowledge
Good understanding of plasma physics and processes is essential.
Practical background on any types of plasma technology and its characterization is needed.
Familiar with common plasma characterization tools (such as OES, ion sensor, RGA, thickness measurement etc.) and methodology.
Knowhow to analyze surface characterization results (XPS, TEM, phase analysis, SIMS, EELS, etc) is a strong plus.
Any backgrounds of WoW or CoW bonding is a bonus.
Opportunities
On-job training on CoW hybrid bonding processes and challenges.
Developing a state-of-the-art integrated hybrid bonder and play a part in this historical industrial inflection from micro-bump/TCB to hybrid bonding. Working with subject-matter experts in various areas around the globe on plasma product development.
Technical training on/ exposure to up & downstream integration processes and interaction with hybrid bonding
Requirements
Engineering or science university educational background.
> 2 years experiences on plasma HW/ process development preferred.
10% travel commitment to the US (California), Taiwan, Korea or Europe
Working Location
Science Park II, Singapore
משרות נוספות שיכולות לעניין אותך