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Apple IC Package Integration Engineer United States, California, Cupertino 907474297
28.03.2024
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Key Qualifications
- We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development
- Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FA
- Knowledgeable in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints
- Excellent problem solving with strong physics and fundamentals
- Excellent communication skills that enable the candidate to work well with internal cross-functional teams and overseas suppliers
- Multi-functional coverage on package layout (Cadence APD/Allegro), critical signal integrity/power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and cost
- Ability to work independently and take on projects with minimum supervision
- Ability to lead and manage teams
- Knowledge of Cellular packaging and systems a plus
- BS and 3+years of relevant industry experience
Education & Experience
BS and 3+years of relevant industry experience
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $138,900.00 and $256,500.00, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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