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Google Chip Package Signal Power Integrity Engineer United States, California, Sunnyvale 472829525
25.09.2024
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Minimum qualifications:
Preferred qualifications:
- Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
- 5 years of industry experience in the SI/PI field.
- Experience in chip package SI/PI design for interconnections and advanced package design.
Preferred qualifications:
- Experience in post silicon correlation with models.
- Experience with 2.5D/3D package design such as silicon interposer, silicon bridge, 3D die stacking.
- Experience in cross-functional collaboration with chip top design, physical design, STA, package, system design, and validation teams.
- Experience in programming and data analysis with Matlab, Python, C++ and statistical tools to establish automation flows and data processing.
- Understanding of on and off chip power delivery and STA/voltage budget.
- Familiarity with memory testing, next generation memory, chiplet standards and timing budget methodology.
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